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The BT1308-600D is a passivated sensitive gate triac housed in a SOT54 (TO-92) plastic single-ended leaded package. It supports a repetitive peak off-state voltage of up to 600 V and an RMS on-state current of 0.8 A. The device features a maximum gate trigger current of 5 mA, with a higher threshold of 7 mA for the T2− G+ quadrant. Non-repetitive peak on-state current reaches 9 A at 20 ms pulse width. Thermal resistance from junction to lead is 60 K/W, while junction-to-ambient resistance is 150 K/W under standard mounting conditions.
Verify the specific ordering suffix against the manufacturer's latest documentation to confirm package type and compliance status. Ensure the component meets RoHS requirements if applicable to your manufacturing process. Cross-reference the part number with official NXP Semiconductors databases to validate current production status and availability before finalizing procurement plans.
Select this component for applications requiring low gate drive power and direct logic interface. The 600 V rating suits general AC line voltage applications. Consider the 0.8 A RMS current limit and thermal characteristics when designing heat dissipation strategies. Verify that the gate trigger currents align with the driving circuit capabilities across all operating quadrants.
This device belongs to the BT1308 series D, which includes variants with different voltage ratings such as the BT1308-400D. All members share the same sensitive gate architecture and SOT54 packaging. The series is designed for logic-level operation, distinguishing it from standard gate triacs that require higher drive currents.
The BT1308-400D serves as a lower voltage alternative within the same series. Other TO-92 packaged triacs may be considered if pinout and electrical ratings match, but direct functional substitution requires verifying gate sensitivity and voltage thresholds.
The maximum gate trigger current is 5 mA for most quadrants and 7 mA specifically for the T2− G+ quadrant.
It features a sensitive gate design that allows direct interfacing with logic level ICs and low-power gate drive circuits without additional amplification.
The thermal resistance from junction to ambient is 150 K/W when mounted on a printed-circuit board with a lead length of 4 mm.