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BTA225B-600B,118 is listed in the Triacs range at ChipApex. The manufacturer field lists WeEn Semiconductors. Its product description is TRIAC 600V 25A D2PAK. Review the specifications below when checking this part for your BOM.
The BTA225B-600B,118 is a planar passivated high commutation three-quadrant triac manufactured by WeEn Semiconductors. It is housed in a TO263 (D2PAK) surface-mountable plastic package designed for circuits experiencing high static and dynamic dV/dt and high dI/dt conditions. The device features an 800 V rated repetitive peak off-state voltage and conducts a maximum RMS on-state current of 25 A. It supports a non-repetitive peak on-state current of 190 A at 50/60 Hz. The component operates with a maximum junction temperature of 125°C and includes a gate trigger current of 50 mA across quadrants Q1, Q2, and Q3.
Verify the specific ordering part number against manufacturer documentation to ensure correct package and packing configuration. Confirm RoHS compliance status and lead-free plating requirements prior to integration. Check for any recent Product Change Notifications regarding assembly sources or labeling updates that may affect supply chain continuity.
Select this component when designing circuits necessitating a D2PAK surface mount TRIAC with 25 A RMS current handling. Ensure the application environment does not exceed the 125°C maximum junction temperature limit. Verify that the circuit's dV/dt and dI/dt stresses remain within the specified limits for reliable commutation without external snubber networks.
This device belongs to the BTA225 series of high commutation triacs from WeEn Semiconductors. It shares architectural similarities with other Series B triacs but is distinguished by its specific voltage rating and TO263 packaging. The component serves as a surface-mount alternative to through-hole variants like the BTA225-600B, facilitating automated PCB assembly processes.
Direct substitutes include the BTA225B-800B,118 for higher voltage applications. Cross-brand equivalents should be evaluated based on matching RMS current, package dimensions, and thermal characteristics.
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