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The BU46K272G-TL is a linear voltage regulator IC manufactured by Rohm Semiconductor. It provides a fixed output voltage of 2.7V with a maximum output current capability of 150mA. The device operates within an input voltage range of 2.8V to 5.5V. Key electrical specifications include a typical dropout voltage of 300mV at 100mA load and a line regulation of 0.05%/V. The unit features built-in protection mechanisms including thermal shutdown and current limiting, ensuring reliable operation in portable electronic applications requiring stable low-voltage power supplies.
Verify the exact ordering code includes the correct suffix for tape and reel packaging when sourcing bulk quantities. Confirm the manufacturer datasheet revision matches your design requirements. Ensure compatibility with RoHS directives if applicable to your region. Cross-reference pinouts with official documentation before PCB layout finalization to prevent integration errors during assembly.
Select this component when a fixed 2.7V output is required with moderate current demands up to 150mA. Consider its low dropout performance for applications where input voltage may approach the output level. Evaluate the thermal characteristics based on expected ambient temperatures and board copper area for heat dissipation. Compare against adjustable regulators if variable output voltages are needed instead of fixed options.
This part belongs to Rohm's BU46 series of low-dropout linear regulators designed for portable equipment. The series offers various fixed output voltages to accommodate different logic families and sensor requirements. The BU46K272G variant specifically targets applications needing a stable 2.7V rail from higher voltage sources like single-cell batteries or USB supplies.
Check for direct pin-compatible alternatives within the same family offering different output voltages if system requirements change. Verify that substitute parts maintain similar dropout voltage and current capabilities. Ensure any replacement maintains the same package type and thermal performance characteristics for seamless integration without redesigning the footprint.