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BU6582GVW-E2 is listed in the Video Processing range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC IMAGE PROCESSOR SBGA. Review the specifications below when checking this part for your BOM.
The BU6582GVW-E2 is a camera image processor manufactured by ROHM Semiconductor, designed for video IC applications. It operates on a supply voltage of 1.5 V with a range from 1.45 V to 1.55 V and consumes 15 mA or 65 mA of current depending on the mode. The device supports a display resolution of 1280 x 1024 pixels with a 16-bit data width via a serial interface. Packaged in an SBGA-120 format for surface mount installation, it functions within a temperature range of -30°C to +85°C and has a power dissipation rating of 380 mW.
This component is officially designated as End-of-Life (EOL) by the manufacturer. Distribution channels indicate that Mouser does not currently sell this product in many regions. Verification of availability should focus on secondary market suppliers or existing stock holders rather than direct manufacturer orders. Confirm RoHS compliance status through official documentation before procurement.
Select this component only if legacy compatibility with 1280 x 1024 resolution and SBGA-120 packaging is required. Ensure the system design accommodates the specific 1.5 V operating voltage and serial interface requirements. Consider the EOL status when planning long-term production cycles, as replacement sourcing may be limited to surplus inventory.
The BU6582GVW-E2 belongs to ROHM's line of camera image processors, specifically engineered for home security and general video processing tasks. It sits within the broader category of video ICs, offering a balance between resolution support and power efficiency. The part is distinct from other BU series models by its specific 1280 x 1024 resolution limit and 8 kV ESD resistance specification.
Publicly confirmed substitute part numbers are not available in the provided source material. Due to the End-of-Life status, alternative components must be evaluated based on pin compatibility, interface standards, and resolution support rather than direct cross-references.
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