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BUF634F/500E3
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Product Detailed Parameters
- Description：IC BUFFER 1 CIRC DDPAK/TO263-5
- Series：-
- Mfr：Texas Instruments
- Package：Tape & Reel (TR)
- Amplifier Type：Buffer
- Number of Circuits：1
- Output Type：-
- Slew Rate：2000V/µs
- Gain Bandwidth Product：-
- Current - Input Bias：5 µA
- Voltage - Input Offset：30 mV
- Current - Supply：15mA
- Current - Output / Channel：250 mA
- Voltage - Supply Span (Min)：4.5 V
- Voltage - Supply Span (Max)：36 V
- Operating Temperature：-40°C ~ 85°C
- Grade：-
- Qualification：-
- Mounting Type：Surface Mount
- Package / Case：TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
- Supplier Device Package：TO-263 (DDPAK-5)
- -3db Bandwidth：180 MHz
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Overview
The BUF634F/500E3 is a high-speed buffer amplifier manufactured by Texas Instruments. It features a single circuit configuration housed in a TO-263 (DDPAK-5) surface-mount package. Key electrical specifications include a supply voltage range of 4.5 V to 36 V, an output current capability of 250 mA per channel, and a supply current of 15 mA. The device exhibits a slew rate of 2000 V/µs and a -3 dB bandwidth of 180 MHz. Input characteristics specify a bias current of 5 µA and an input offset voltage of 30 mV. It operates within a temperature range of -40°C to 85°C.
Feature Summary
- Provides high-speed signal buffering with a 2000 V/µs slew rate for fast transient response.
- Delivers substantial load driving capability through a 250 mA continuous output current rating.
- Operates on a wide single-supply voltage range from 4.5 V up to 36 V.
- Designed for surface-mount integration using the TO-263 (DDPAK-5) thermal package.
Applications
- Video signal distribution and line driving
- High-speed data acquisition system front-ends
- Impedance matching between stages in analog circuits
Procurement Notes
Verify the specific suffix 'E3' indicates lead-free compliance and RoHS status during procurement. Confirm the 'F/500' designation corresponds to the standard tape-and-reel packaging quantity of 500 units. Ensure the TO-263-5 pinout matches the target PCB footprint design requirements before finalizing orders.
Selection Notes
Select this component when a single-channel buffer requires high current drive capabilities exceeding standard op-amp limits. The TO-263 package offers superior thermal dissipation compared to smaller surface-mount options. Consider the 180 MHz bandwidth and 2000 V/µs slew rate for applications demanding rapid signal transitions without significant distortion.
Part Context
This part belongs to the BUF634 family of high-speed buffer amplifiers originally developed by Burr-Brown and acquired by Texas Instruments. The family includes variants with different packages such as PDIP-8, SOIC-8, and TO-220. The F/500 variant specifically denotes the surface-mount DDPAK-5 form factor supplied in reels.
Replacement Considerations
Public confirmed substitute part numbers include BUF634F and BUF634FKTTTE3. Verify pin compatibility and thermal performance when substituting these equivalents.
