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BUF634F/500E3 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUFFER 1 CIRC DDPAK/TO263-5. Review the specifications below when checking this part for your BOM.
The BUF634F/500E3 is a high-speed buffer amplifier manufactured by Texas Instruments. It features a single circuit configuration housed in a TO-263 (DDPAK-5) surface-mount package. Key electrical specifications include a supply voltage range of 4.5 V to 36 V, an output current capability of 250 mA per channel, and a supply current of 15 mA. The device exhibits a slew rate of 2000 V/µs and a -3 dB bandwidth of 180 MHz. Input characteristics specify a bias current of 5 µA and an input offset voltage of 30 mV. It operates within a temperature range of -40°C to 85°C.
Verify the specific suffix 'E3' indicates lead-free compliance and RoHS status during procurement. Confirm the 'F/500' designation corresponds to the standard tape-and-reel packaging quantity of 500 units. Ensure the TO-263-5 pinout matches the target PCB footprint design requirements before finalizing orders.
Select this component when a single-channel buffer requires high current drive capabilities exceeding standard op-amp limits. The TO-263 package offers superior thermal dissipation compared to smaller surface-mount options. Consider the 180 MHz bandwidth and 2000 V/µs slew rate for applications demanding rapid signal transitions without significant distortion.
This part belongs to the BUF634 family of high-speed buffer amplifiers originally developed by Burr-Brown and acquired by Texas Instruments. The family includes variants with different packages such as PDIP-8, SOIC-8, and TO-220. The F/500 variant specifically denotes the surface-mount DDPAK-5 form factor supplied in reels.
Public confirmed substitute part numbers include BUF634F and BUF634FKTTTE3. Verify pin compatibility and thermal performance when substituting these equivalents.
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