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BUK217-50YT,118 is listed in the Power Distribution Switches, Load Drivers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC PWR DRIVER N-CHAN 1:1 SOT426. Review the specifications below when checking this part for your BOM.
The BUK217-50YT,118 is an obsolete TOPFET high-side power switch manufactured by NXP Semiconductors. It integrates an N-channel MOSFET with driver circuitry in a surface-mount D2PAK (TO-263) package. The device supports a drain-source voltage of 50V and handles continuous currents up to 44A. It operates with logic-level inputs ranging from 5.5V to 35V. Key protective features include overcurrent protection, thermal shutdown, and reverse polarity protection. The component is designed for robust power distribution applications requiring integrated switching and diagnostics.
This component is officially marked as obsolete by the manufacturer. Sourcing new units may be difficult or impossible through primary channels. Buyers should verify the authenticity of available stock carefully, as counterfeit parts are common for discontinued items. Consider evaluating current replacement alternatives from the same product family or compatible competitors to ensure long-term supply chain stability and compliance with modern manufacturing standards.
Select this part only if legacy compatibility is strictly required. Verify that the D2PAK footprint matches the PCB design. Ensure the application voltage does not exceed the 50V rating. Check that the thermal management solution can handle the dissipation at peak loads. Confirm that the input logic levels align with the 5.5V to 35V operating range. Evaluate alternative components if future production longevity is a priority.
The BUK217 series belongs to NXP's TOPFET line of intelligent power switches. These devices combine power MOSFETs with control electronics for simplified system design. The BUK217-50YT variant specifically targets high-current applications requiring reliable switching in automotive and industrial environments. It replaces discrete MOSFET solutions by integrating protection features directly into the package.
Check for direct pin-compatible substitutes within the BUK217 family or newer NXP TOPFET generations. Verify electrical parameters such as Rds(on) and Vgs thresholds match the original design requirements. Ensure the replacement package type is compatible with existing assembly processes.
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