BUK9M9R5-40HX

$0.48

Description：MOSFET N-CH 40V 40A LFPAK33
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:1c6c1755b55f Category: Single FETs, MOSFETs Brand: Nexperia USA Inc.

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Product introduction

Product Detailed Parameters

Description：MOSFET N-CH 40V 40A LFPAK33
Series：-
Mfr：Nexperia USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：40 V
Current - Continuous Drain (Id) @ 25°C：40A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
Rds On (Max) @ Id, Vgs：9.5mOhm @ 15A, 10V
Vgs(th) (Max) @ Id：2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs：24 nC @ 10 V
Vgs (Max)：+16V, -10V
Input Capacitance (Ciss) (Max) @ Vds：1537 pF @ 25 V
FET Feature：-
Power Dissipation (Max)：55W (Tc)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：Automotive
Qualification：AEC-Q101
Mounting Type：Surface Mount
Supplier Device Package：LFPAK33
Package / Case：SOT-1210, 8-LFPAK33 (5-Lead)

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BUK9M9R5-40HX

Overview

The BUK9M9R5-40HX is an automotive qualified logic level N-channel MOSFET utilizing Trench 9 superjunction technology. It features a maximum drain-source voltage of 40 V and a continuous drain current of 40 A at 25 °C mounting base temperature. The device exhibits a typical on-state resistance of 9.5 mΩ at VGS = 10 V and ID = 15 A. Total power dissipation reaches 55 W under specified conditions. The component operates within a junction temperature range of -55 °C to +175 °C and includes repetitive avalanche rating capabilities.

Feature Summary

Fully automotive qualified to AEC-Q101 standards with a 175 °C operating rating for thermally demanding environments.
Trench 9 superjunction technology provides low power losses and high power density through reduced cell pitch.
LFPAK copper clip package technology ensures high robustness, reliability, and improved thermal performance.
Gull wing leads facilitate high manufacturability and enable visual automated optical inspection (AOI).

Applications

12 V automotive systems
Powertrain, chassis, body and infotainment applications
Medium/Low power motor drive
DC-DC systems
LED lighting

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm exact packaging and reel specifications. Confirm that the delivered components match the required AEC-Q101 qualification status for automotive integration. Ensure compatibility with LFPAK33 footprint dimensions during PCB layout finalization. Cross-reference marking codes with the latest datasheet revisions to prevent counterfeit or obsolete stock acceptance.

Selection Notes

Select this component for designs requiring logic level gate drive compatibility in compact automotive modules. The LFPAK33 package offers a small footprint suitable for space-constrained layouts while maintaining high current handling. Evaluate thermal management strategies based on the junction-to-mounting base thermal resistance characteristics. Consider the repetitive avalanche rating when designing circuits subject to inductive load switching or transient voltage events.

Part Context

This device belongs to Nexperia's portfolio of automotive-grade power switches designed for high-performance applications. It utilizes advanced Trench 9 technology to achieve superior efficiency compared to standard planar MOSFETs. The product is specifically engineered to meet rigorous automotive reliability standards, ensuring longevity in harsh electrical and thermal environments found in modern vehicle architectures.