BUK9Y19-55B,115

BUK9Y19-55B,115

$0.97
  • Description:MOSFET N-CH 55V 46A LFPAK56
  • Series:TrenchMOS™
  • Mfr:Nexperia USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:6ceee4eada6c Category: Brand:

  
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Product Detailed Parameters

  • Description:MOSFET N-CH 55V 46A LFPAK56
  • Series:TrenchMOS™
  • Mfr:Nexperia USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • FET Type:N-Channel
  • Technology:MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss):55 V
  • Current - Continuous Drain (Id) @ 25°C:46A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On):5V
  • Rds On (Max) @ Id, Vgs:17.3mOhm @ 20A, 10V
  • Vgs(th) (Max) @ Id:2V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs:18 nC @ 5 V
  • Vgs (Max):±15V
  • Input Capacitance (Ciss) (Max) @ Vds:1992 pF @ 25 V
  • FET Feature:-
  • Power Dissipation (Max):85W (Tc)
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Grade:Automotive
  • Qualification:AEC-Q101
  • Mounting Type:Surface Mount
  • Supplier Device Package:LFPAK56, Power-SO8
  • Package / Case:SC-100, SOT-669

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BUK9Y19-55B,115

Overview

The BUK9Y19-55B,115 is a logic level N-channel enhancement mode power FET utilizing Nexperia High-Performance Automotive TrenchMOS technology. It is designed for automotive critical applications and qualified to AEC-Q101 standards. The device features a 55 V drain-source voltage rating and operates with a junction temperature range of -55 °C to 175 °C. Key electrical parameters include a continuous drain current of 46 A at 25 °C mounting base temperature, a maximum on-state resistance of 19 mΩ at VGS=5V and ID=20A, and a total gate charge of 18 nC. Non-repetitive avalanche energy capability is rated at 80 mJ.

Feature Summary

  • Logic level compatible for direct drive from standard logic sources
  • Qualified to AEC-Q101 automotive reliability standards
  • Rated for operation in thermally demanding environments up to 175 °C
  • Very low on-state resistance reduces conduction losses

Applications

  • 12 V and 24 V loads
  • Automotive systems
  • General purpose power switching
  • Motors, lamps and solenoids

Procurement Notes

Verify the specific ordering suffix

Selection Notes

Select this component when designing circuits requiring logic-level gate drive compatibility without additional driver stages. The LFPAK package provides efficient thermal dissipation suitable for high-current applications. Ensure the design accounts for the derating of drain current as mounting base temperature increases beyond 25 °C, referencing the provided thermal impedance curves for accurate power handling calculations.

Part Context

This part belongs to the BUK9Y series of N-channel TrenchMOS logic level FETs manufactured by Nexperia. These devices are specifically engineered for high-performance automotive electronics where reliability under harsh conditions is mandatory. The SOT669 (LFPAK) package integrates a large mounting base connected to the drain for superior heat transfer compared to standard plastic packages.

Replacement Considerations

Public confirmed substitute part numbers: None identified.

BUK9Y19-55B,115BUK9Y19-55B,115
$0.97
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