BV302D24024

Overview

The BV302D24024 is a 2.4VA encapsulated power transformer from Zettler Magnetics, designed for through-hole mounting. It features a 230V primary input and a 24V secondary output capable of delivering 50mA. The unit utilizes an EI30 lamination size with a core height of 15.5mm. Physical dimensions include a case size of 32.8x27.8mm and a height of 27.4mm. It operates at 50/60Hz frequencies and is fully encapsulated under vacuum pressure.

Feature Summary

• Fully encapsulated construction under vacuum pressure for enhanced efficiency and compactness
• Laminated core design utilizing EI30 geometry
• Through-hole mounting configuration for standard PCB integration

Applications

• General purpose linear power supply circuits
• Low voltage AC signal isolation
• Control panel power distribution

Procurement Notes

Verify the specific datasheet version provided by Zettler Magnetics or authorized distributors to confirm compliance with current RoHS standards and insulation class requirements. Ensure that the 230V primary rating matches the local mains frequency specifications before integration into the final assembly to prevent operational failure.

Selection Notes

Select this component when a compact, encapsulated solution is required for low-power applications demanding 24VAC output. The EI30 form factor suits space-constrained designs where thermal performance and mechanical stability are prioritized over high-capacity power delivery. Confirm that the 50mA secondary current meets the load requirements.

Part Context

This model belongs to the BV series of encapsulated power transformers manufactured by Zettler Magnetics. The series is characterized by vacuum-pressure encapsulation techniques aimed at reducing size while maintaining electrical safety. The BV302D24024 specifically represents the 2.4VA variant within the EI30_24 product line.

Replacement Considerations

Cross-reference with other BV series variants such as BV302D24006 for different VA ratings. Verify pinout compatibility and physical footprint alignment before substituting with components from other manufacturers offering similar EI30 encapsulated transformers.