BV302D24028

Overview

The BV302D24028 is a laminated power transformer from the Zettler Magnetics BV series, designed for through-hole mounting. It features a 230V primary winding and a dual secondary configuration providing 2x24V at 58mA each, resulting in a total power rating of 2.8VA. The unit operates at 50/60Hz frequencies. Its construction utilizes vacuum pressure encapsulation to ensure compactness and efficiency within linear power supply applications.

Feature Summary

• Fully encapsulated under vacuum pressure for enhanced structural integrity and environmental protection
• Laminated core design optimized for efficient linear power conversion
• Through-hole termination style suitable for standard PCB assembly processes

Applications

• Linear power supply circuits requiring isolated AC voltage transformation
• Electronic equipment utilizing 24VAC control or signal processing stages
• Industrial instrumentation with specific low-power isolation requirements

Procurement Notes

Verify the complete part number including suffixes against official Zettler Magnetics documentation to confirm electrical specifications and pinout configurations. Ensure compatibility with existing PCB footprints and thermal management strategies before integration into production designs.

Selection Notes

Select this component when a 2.8VA capacity with dual 24V secondaries is required for linear topologies. Consider the physical dimensions and through-hole mounting constraints relative to the enclosure space available in the target application system.

Part Context

This transformer belongs to the BV series of encapsulated power transformers manufactured by Zettler Magnetics. The series is characterized by vacuum-encapsulated laminated cores intended to provide reliable performance in compact linear power supply designs across various industrial and commercial electronic sectors.

Replacement Considerations

Consult official manufacturer substitution guides for verified equivalents. Cross-referencing must confirm identical electrical ratings, encapsulation type, and mechanical footprint to maintain circuit integrity.