BV302S06010

Overview

The BV302S06010 is a 1.0 VA encapsulated power transformer manufactured by Zettler Magnetics, designed for through-hole mounting. It features a single primary winding rated for 230V input and a secondary output of 6V at 166mA. The unit provides 4.2kV isolation voltage and utilizes an EI30-10.5 core configuration. It complies with RoHS3 standards and carries an EAR99 classification.

Feature Summary

• Encapsulated construction for environmental protection
• Through-hole mounting with PC pin termination
• High isolation voltage rating of 4.2kV

Applications

• General purpose AC to DC power supply circuits
• Industrial control equipment power stages
• Consumer electronics internal power conversion

Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm exact electrical characteristics and insulation class. Ensure the procurement channel provides valid traceability for RoHS3 compliance status. Cross-reference the datasheet version to confirm compatibility with current safety regulations before finalizing purchase orders.

Selection Notes

Select this component when a compact, encapsulated transformer is required for low-power applications needing 230V primary input. The 1.0 VA rating suits light loads, while the 4.2kV isolation ensures safety in mains-connected designs. Consider the through-hole form factor for PCBs requiring robust mechanical anchoring compared to surface-mount alternatives.

Part Context

This part belongs to Zettler Magnetics' line of sealed power transformers, utilizing the EI30-10.5 core geometry. It is distinct from the AHI series which uses laminated cores and different packaging. The encapsulation style differentiates it from open-frame variants within the same brand portfolio, offering enhanced durability for harsh environments.

Replacement Considerations

Direct substitutes include BV302S06010-ZU. Verify that replacement units maintain identical 6V/166mA output specifications and 4.2kV isolation ratings. Ensure physical footprint compatibility for existing PCB layouts.