BVM25JB300R

Overview

The BVM25JB300R is a vertical mount wirewound resistor manufactured by Stackpole Electronics Inc. It features a ceramic housing and offers a resistance of 300 Ohms with a tolerance of ±5%. The component is rated for 25W power dissipation and can withstand voltage up to 600V. It operates within a temperature range of -55°C to +275°C and has a temperature coefficient of 300 PPM/°C. The physical dimensions are 13 mm in diameter and 60 mm in length, utilizing radial termination for PCB mounting.

Feature Summary

• Vertical mount design with integrated brackets for secure installation
• Ceramic housing construction for thermal stability
• Wirewound technology suitable for high-power applications

Applications

• Industrial power supply circuits
• High-current limiting applications
• Load banking and testing equipment

Procurement Notes

Verify the specific manufacturer designation, as SEI Stackpole and Stackpole Electronics Inc may be referenced interchangeably. Confirm the vertical mounting orientation and bracket configuration match the mechanical requirements of the target assembly. Ensure the 300 Ohm value and 25W rating align with the circuit design specifications before ordering.

Selection Notes

Select this component when a robust, vertically oriented through-hole resistor is required for high-power environments. The ceramic housing and wirewound construction provide durability under thermal stress. Consider the 60 mm length and radial leads for adequate spacing on the printed circuit board layout.

Part Context

This part belongs to the BVM series of vertical mount wirewound resistors from Stackpole. These components are designed for chassis or panel mounting scenarios where space efficiency and heat dissipation are critical. The series typically includes various resistance values and power ratings tailored for industrial electronics.

Replacement Considerations

Direct substitutes must match the 300 Ohm resistance, 25W power rating, vertical mounting style, and radial termination. Verify that any alternative component maintains similar thermal characteristics and physical dimensions to fit the existing bracket system.