Memory IC BY25D16ASMIG(R) product image

BY25D16ASMIG(R)

$0.16
  • Description:IC FLASH 16MBIT SPI/DUAL 8USON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR)

SKU:1220df202349 Category: Brand:

  
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BY25D16ASMIG(R) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 16MBIT SPI/DUAL 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25D16ASMIG(R)

  • Description:IC FLASH 16MBIT SPI/DUAL 8USON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Dual I/O
  • Clock Frequency:108 MHz
  • Write Cycle Time - Word, Page:2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-UFDFN Exposed Pad
  • Supplier Device Package:8-USON (2x3)
  • Access Time:7 ns

Memory IC datasheet and documents for BY25D16ASMIG(R)

BY25D16ASMIG(R)

Memory IC Overview

The BY25D16ASMIG(R) is a 16M-bit SPI NOR Flash memory from BYTe Semiconductor. It supports Standard and Dual SPI interfaces, with Dual Output data transfer speeds reaching 108 Mbits/s. The device operates on a single low voltage supply ranging from 2.7V to 3.6V. Key performance metrics include a typical page program time of 0.7ms, sector erase time of 100ms, block erase times of 0.3s or 0.5s, and chip erase time of 15s. It features flexible architecture with 4KB sectors and 32/64KB blocks.

Memory IC Feature Summary

  • Supports Dual SPI operation for high-speed data transfer using bidirectional I/O pins.
  • Provides hardware and software write protection mechanisms including block protect bits and status register lock.
  • Includes a factory-set unique 64-bit ID number for system security and anti-cloning purposes.
  • Features deep power-down mode to minimize current consumption in battery-powered applications.

Memory IC Applications

  • Battery-powered electronic devices requiring low standby current
  • Systems needing hardware-protected firmware storage areas
  • Applications utilizing dual-data-rate serial communication protocols

Memory IC Procurement Notes

Verify the specific package variant (e.g., USON 2x3mm) matches the design requirements, as the datasheet lists multiple options. Confirm the temperature grade corresponds to the intended operating environment. Ensure the ordering suffix aligns with the required packing quantity and pin configuration details provided in the official documentation.

Memory IC Selection Notes

Select this component when Dual SPI interface speed is required over standard SPI. Consider the 16M-bit density for code storage needs. Evaluate the 2.7V to 3.6V supply range against the system power rails. Check if the available packages like USON or SOP fit the PCB layout constraints.

Memory IC Part Context

This part belongs to the BY25D16AS family of 16M-bit SPI NOR Flash memories. It is designed for general-purpose non-volatile storage with support for fast read commands. The manufacturer offers various package options including SOP and USON formats to accommodate different board space and thermal requirements.

Memory IC Replacement Considerations

Cross-reference with other 16M-bit SPI NOR Flash parts supporting Dual SPI. Verify pin compatibility and command set alignment before substitution. Ensure voltage and temperature specifications match the original design parameters.

Memory IC FAQ

How does the Dual SPI interface improve performance?

Dual SPI allows data to be transferred at two times the rate of standard SPI by using both SI and SO pins as bidirectional I/O lines during read operations.

What is the purpose of the Unique ID Number instruction?

It accesses a factory-set 64-bit number unique to each device, which can be used to prevent copying or cloning of the system.

BY25D16ASMIG(R)BY25D16ASMIG(R)
$0.16
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