BY25D16ASSIG(R)

$0.18

Description：IC FLASH 16MBIT SPI/DUAL 8SOP
Series：-
Mfr：BYTe Semiconductor
Package：Tape & Reel (TR)

SKU:51c8bb7bffd1 Category: Memory IC Brand: BYTe Semiconductor

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Product introduction

BY25D16ASSIG(R) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 16MBIT SPI/DUAL 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25D16ASSIG(R)

Description：IC FLASH 16MBIT SPI/DUAL 8SOP
Series：-
Mfr：BYTe Semiconductor
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR
Memory Size：16Mbit
Memory Organization：2M x 8
Memory Interface：SPI - Dual I/O
Clock Frequency：108 MHz
Write Cycle Time - Word, Page：2.4ms
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：8-SOIC (0.209", 5.30mm Width)
Supplier Device Package：8-SOP
Access Time：7 ns

Memory IC datasheet and documents for BY25D16ASSIG(R)

BY25D16ASSIG(R)

Memory IC Overview

The BY25D16ASSIG(R) is a 16M-bit SPI NOR Flash memory by BYTe Semiconductor. It supports Standard and Dual SPI interfaces with clock rates up to 108 MHz for Fast Read and Dual Output modes. The device operates on a single 2.7V to 3.6V supply, featuring 20mA active current and 5µA power-down current. It offers flexible architecture with 4KB sectors and 32/64KB blocks, hardware/software write protection, and endurance of 100k cycles with 20-year data retention.

Memory IC Feature Summary

Supports Dual SPI operation for high-speed data transfer at 108 Mbits/s
Provides hardware and software write protection mechanisms via /WP pin and status register bits
Includes Deep Power-Down mode for reduced standby current consumption
Features factory-set unique 64-bit ID number for system security

Memory IC Applications

Battery-powered devices requiring low standby current
Systems needing secure identification via Unique ID
Applications requiring hardware write protection

Memory IC Procurement Notes

Verify the specific package variant (SOP, TSSOP, USON, DFN) as the base part number covers multiple options. Confirm the temperature grade matches the application requirements, as industrial ranges vary. Ensure the ordering suffix corresponds to the desired packing quantity and package type specified in the manufacturer's order information section.

Memory IC Selection Notes

Select this component for designs requiring 16Mb density with dual I/O speed capabilities. Consider the available package options including SOP and USON variants based on board space constraints. Verify that the operating voltage range of 2.7V to 3.6V aligns with the system power supply. Check if the specific temperature range (Commercial or Industrial) meets the environmental specifications.

Memory IC Part Context

The BY25D16AS series belongs to BYTe Semiconductor's 16M-bit SPI NOR Flash family. It shares architectural similarities with other models in the BY25Q and BY25D lines but is distinct in its specific density and interface support. The 'SIG' suffix typically denotes specific packaging or tape-and-reel configurations within the manufacturer's catalog.