Memory IC BY25D16ASTIG(T) product image

BY25D16ASTIG(T)

$0.15
  • Description:IC FLASH 16MBIT SPI/DUAL 8SOP
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tube

SKU:08d9c307f0b6 Category: Brand:

  
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BY25D16ASTIG(T) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 16MBIT SPI/DUAL 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25D16ASTIG(T)

  • Description:IC FLASH 16MBIT SPI/DUAL 8SOP
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tube
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Dual I/O
  • Clock Frequency:108 MHz
  • Write Cycle Time - Word, Page:2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:7 ns

Memory IC datasheet and documents for BY25D16ASTIG(T)

BY25D16ASTIG(T)

Memory IC Overview

The BY25D16ASTIG(T) is a 16M-bit SPI NOR Flash memory supporting Standard and Dual SPI interfaces. It operates on a single 2.7V to 3.6V supply. Read speeds include 55MHz for Normal Read, 108MHz for Fast Read, and 108MHz for Dual Output Fast Read. The device features a flexible architecture with 4KB sectors and 32/64KB blocks. Program/Erase times are 0.7ms typical for page programming, 100ms for sector erase, and 15s for chip erase. Active current is 20mA maximum, dropping to 5uA in power-down mode.

Memory IC Feature Summary

  • Supports Dual SPI operation for data transfer at twice the rate of standard SPI using bidirectional I/O pins.
  • Provides hardware and software write protection mechanisms including block protect bits and status register lock.
  • Includes a factory-set unique 64-bit ID number accessible via specific instructions to prevent system cloning.
  • Features deep power-down mode to minimize standby current consumption for battery-powered applications.

Memory IC Applications

  • Battery-powered devices requiring low standby current
  • System firmware storage
  • Code execution in place (XIP)
  • Data logging applications

Memory IC Procurement Notes

Verify the suffix 'T' indicates tube packaging when ordering. Confirm the temperature grade matches the application requirements, as industrial ranges vary. Ensure the voltage supply remains within the specified 2.7V to 3.6V range during operation. Check for RoHS compliance status if required by local regulations.

Memory IC Selection Notes

Select this component for designs requiring dual SPI interface support or specific block protection features. Consider the package options available, such as SOP or USON, based on board space constraints. Verify that the clock frequency requirements align with the supported read modes. Ensure the operating temperature range meets the environmental conditions of the target application.

Memory IC Part Context

This part belongs to the BYTe Semiconductor BY25D16AS family of 16M-bit SPI NOR Flash memories. It shares architectural similarities with other models in the series but differs in interface support and package options. The device is designed for high-reliability applications requiring robust write protection and fast read speeds.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: None listed in source material.

Memory IC FAQ

How does the Dual SPI interface differ from Standard SPI?

Dual SPI uses bidirectional I/O pins (IO0 and IO1) to transfer data two bits per clock cycle, doubling the data rate compared to Standard SPI which uses separate input and output pins.

What is the purpose of the Deep Power-Down instruction?

The Deep Power-Down instruction reduces standby current consumption significantly, making it suitable for battery-powered applications where minimizing power usage is critical.

Can the entire memory be protected from writes?

Yes, by setting the Block Protect bits (BP2, BP1, BP0) to 111, all memory sectors can be protected against Page Program, Sector Erase, and Block Erase instructions.

BY25D16ASTIG(T)BY25D16ASTIG(T)
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