BY25Q16AWSIG(T)

Memory IC Overview

The BY25Q16AWSIG(T) is a 16M-bit SPI NOR Flash memory by BYTe Semiconductor. It supports Standard, Dual, and Quad SPI interfaces with clock rates up to 100MHz for read operations. The device operates on a single supply voltage ranging from 1.65V to 3.6V. It features flexible architecture with 4KB sectors and 32/64KB blocks. Key specifications include a typical page program time of 2ms, sector/block erase time of 8ms, and chip erase time of 8ms. Endurance is rated at 10k cycles with 20-year data retention.

Memory IC Feature Summary

• Supports Standard, Dual, and Quad SPI modes with software/hardware reset capabilities
• Features flexible erase architecture with 4KB sectors and 32/64KB blocks
• Includes three 512-byte security registers with OTP lock functionality
• Operates on a single low voltage power supply ranging from 1.65V to 3.6V

Memory IC Applications

• Consumer electronics code shadowing
• Data storage applications
• Industrial control systems

Memory IC Procurement Notes

Verify the specific package variant (SOP8 or USON8) required for your design, as the datasheet lists multiple options. Confirm the temperature grade matches your application needs, noting that Industrial grades extend to +105°C. Ensure the ordering suffix aligns with the desired packing quantity and pin pitch specifications found in the official documentation.

Memory IC Selection Notes

Select this component for applications requiring wide voltage operation down to 1.65V. Consider the Quad SPI mode for high-speed data transfer requirements. Evaluate the security register features if write protection is critical. Verify compatibility with host controllers supporting standard, dual, or quad SPI protocols before finalizing the design.

Memory IC Part Context

This part belongs to the BY25Q16AW series of 16M-bit SPI NOR Flash memories. It is designed for high-volume consumer applications where code execution from RAM is preferred. The series offers various package options including SOP8 and USON8 to suit different PCB layout constraints and thermal requirements.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.