BY25Q16ESMIG(R)

Memory IC Overview

The BY25Q16ESMIG(R) is a 16 Mbit SPI NOR Flash memory by BYTe Semiconductor. It supports Standard, Dual, and Quad SPI interfaces, with a maximum clock frequency of 108 MHz. The device operates on a single 2.7 V to 3.6 V supply voltage. Key electrical parameters include a typical page program time of 0.16 ms, sector erase time of 20 ms, and block erase times of 0.055 s or 0.2 s. It features a cycling endurance of 100k program-erase cycles and data retention of 20 years.

Memory IC Feature Summary

• Supports standard, dual, and quad SPI protocols along with QPI mode for high-speed data transfer.
• Enables Execute In Place (XIP) operation through continuous read modes with wrap capabilities.
• Provides flexible software and hardware write protection mechanisms including security registers.
• Includes programmable power-down states and hardware reset functionality via the /HOLD pin.

Memory IC Applications

• Firmware storage in embedded systems
• Code execution from flash memory
• Data logging applications
• Consumer electronics devices

Memory IC Procurement Notes

Verify the specific package suffix 'MIG' against official datasheets to confirm the exact physical dimensions and pinout configuration. Ensure the ordering code matches the required temperature range and voltage specifications. Cross-reference manufacturer part numbers to avoid confusion with similar model variants.

Memory IC Selection Notes

Select this component when a 16 Mbit capacity is required with support for high-speed Quad I/O and QPI operations. It is suitable for designs needing XIP capabilities and robust write protection features. Verify that the system voltage falls within the 2.7 V to 3.6 V operating range and that the interface timing requirements align with the 108 MHz clock limit.

Memory IC Part Context

This part belongs to the BY25Q16ES family of serial NOR flash memories. It is designed as a drop-in replacement for other industry-standard 16 Mbit SPI flash devices. The product line offers various packaging options to accommodate different board space constraints while maintaining consistent electrical performance and command set compatibility.

Memory IC Replacement Considerations

Check pinout compatibility and command set alignment with existing designs. Verify voltage levels and interface speeds match the target system requirements. Confirm that the new component's package dimensions fit the available PCB footprint without mechanical interference.