Memory IC BY25Q16ESTIG(T) product image

BY25Q16ESTIG(T)

$0.17
  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tube

SKU:a3bcc6d4b7f2 Category: Brand:

  
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BY25Q16ESTIG(T) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 16MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25Q16ESTIG(T)

  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tube
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:108 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:7 ns

Memory IC datasheet and documents for BY25Q16ESTIG(T)

BY25Q16ESTIG(T)

Memory IC Overview

The BY25Q16ESTIG(T) is a 16M-bit SPI NOR Flash memory by BYTe Semiconductor, housed in an 8-SOP package. It supports Standard, Dual, Quad SPI, and QPI interfaces with clock frequencies up to 108MHz. The device operates on a single 2.7V to 3.6V supply, featuring fast read speeds of up to 432Mbits/s via Quad I/O or QPI modes. Key electrical parameters include a typical page program time of 0.16ms, sector erase time of 20ms, and block erase times of 0.055s/0.2s. It offers 100k program-erase cycles endurance and 20-year data retention.

Memory IC Feature Summary

  • Supports multiple interface modes including Standard, Dual, Quad SPI, and QPI for flexible system integration.
  • Enables Execute In Place (XIP) operation through continuous read modes with minimal instruction overhead.
  • Provides comprehensive write protection mechanisms including hardware /WP pin control and software-based sector/block locking.
  • Includes three 1024-byte security registers with One-Time Programmable (OTP) lock capabilities.

Memory IC Applications

  • Firmware storage for microcontrollers and embedded processors
  • Code execution directly from flash memory (XIP)
  • Data logging and configuration parameter storage
  • Boot code storage for IoT devices

Memory IC Procurement Notes

Verify the specific suffix 'T' corresponds to tube packaging when ordering. Confirm the operating temperature range matches the required industrial or commercial grade, as the datasheet lists multiple thermal options. Ensure the host system voltage aligns with the 2.7V-3.6V specification. Cross-reference the JEDEC ID and unique ID requirements if device identification is critical to the application design.

Memory IC Selection Notes

Select this component for applications requiring high-speed serial access with XIP capabilities. The 16Mbit density suits moderate firmware sizes. Consider the 8-SOP package constraints for PCB layout. Evaluate the power consumption profiles, noting the maximum active current and standby current specifications. Verify that the supported erase block sizes (4KB sectors, 32/64KB blocks) align with the file system or update strategy.

Memory IC Part Context

This part belongs to the BY25Q16ES family of 16M-bit SPI NOR Flash memories. It shares architectural similarities with other BYTe Semiconductor flash devices but is distinct in its specific capacity and interface timing characteristics. The 'ESTIG(T)' designation indicates the specific package type and packing method within the broader product line.

Memory IC Replacement Considerations

BY25Q16ESSIG(T)

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