Memory IC BY25Q256FSEIG(R) product image

BY25Q256FSEIG(R)

$1.81
  • Description:IC FLASH 256MBIT SPI/QUAD
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:325efa63d7be Category: Brand:

  
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BY25Q256FSEIG(R) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 256MBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25Q256FSEIG(R)

  • Description:IC FLASH 256MBIT SPI/QUAD
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:100 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (8x6)
  • Access Time:7 ns

Memory IC datasheet and documents for BY25Q256FSEIG(R)

BY25Q256FSEIG(R)

Memory IC Overview

The BY25Q256FSEIG(R) is a 256M-bit Serial Peripheral Interface (SPI) NOR Flash memory manufactured by BYTe Semiconductor. It supports Standard, Dual, Quad SPI, and QPI modes with Double Transfer Rate (DTR) read capabilities. The device operates on a single supply voltage ranging from 2.7V to 3.6V. Key performance metrics include a normal serial read clock rate of 55MHz and fast read rates up to 100MHz. Data transfer speeds reach 200Mbits/s for Dual I/O and 400Mbits/s for Quad I/O and QPI. The memory architecture consists of uniform 4KB sectors and 32/64KB blocks. It features typical page program times of 0.6ms and sector erase times of 50ms.

Memory IC Feature Summary

  • Supports multiple interface modes including Standard SPI, Dual SPI, Quad SPI, and QPI with Double Transfer Rate (DTR) read functionality.
  • Features flexible memory architecture with 4KB sectors and 32/64KB blocks, supporting both 3-byte and 4-byte addressing modes.
  • Includes comprehensive write protection mechanisms such as hardware /WP pin control, software protection, and advanced block/sector locking with password support.
  • Provides low power consumption with maximum active current of 25mA and power down current of 5uA, suitable for battery-operated applications.

Memory IC Applications

  • Embedded systems requiring code execution in place (XIP)
  • Industrial control systems operating in wide temperature ranges
  • Consumer electronics storing firmware and configuration data
  • Communication devices needing high-speed data retrieval

Memory IC Procurement Notes

Verify the specific package variant corresponding to the suffix 'EIG' against official ordering information, as BYTe offers SOP and WSON packages. Confirm that the required address mode (3-byte or 4-byte) aligns with system design constraints. Ensure voltage levels match the 2.7V-3.6V specification. Check for RoHS compliance status if environmental regulations apply. Validate lead times and minimum packing quantities directly with the manufacturer or authorized distributors.

Memory IC Selection Notes

Select this component when a 256M-bit capacity is required with high-speed Quad I/O or QPI interfaces. Consider the 8-WSON(8x6) package if space-constrained surface mount solutions are needed. Evaluate the need for DTR read speeds exceeding standard Quad SPI limits. Ensure the application benefits from the integrated security registers and advanced protection features. Compare power consumption requirements against other NOR Flash options in the market.

Memory IC Part Context

The BY25Q256FS series belongs to BYTe Semiconductor's line of high-density SPI NOR Flash memories. It is designed to compete with industry-standard 256M-bit devices, offering comparable pinouts and command sets while providing enhanced features like DTR read and advanced security. The family includes various package options to suit different PCB layout requirements and thermal management needs.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: None identified in source material.

BY25Q256FSEIG(R)BY25Q256FSEIG(R)
$1.81
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