Memory IC BY25Q32ESHIG(R) product image

BY25Q32ESHIG(R)

$0.22
  • Description:IC FLASH 32MBIT SPI/QUAD 8USON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR)

SKU:8cff3ef37836 Category: Brand:

  
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BY25Q32ESHIG(R) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 32MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25Q32ESHIG(R)

  • Description:IC FLASH 32MBIT SPI/QUAD 8USON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:120 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-USON (4x3)
  • Access Time:11.5 ns

Memory IC datasheet and documents for BY25Q32ESHIG(R)

BY25Q32ESHIG(R)

Memory IC Overview

The BY25Q32ESHIG(R) is a 32M-bit SPI NOR Flash memory from BYTe Semiconductor. It supports Standard, Dual, and Quad SPI interfaces with clock rates up to 120MHz for fast read operations. The device operates on a single 2.7V to 3.6V supply voltage. Key performance metrics include a typical page program time of 0.45ms, sector erase time of 35ms, and block erase times of 0.10s or 0.18s depending on size. It features flexible architecture with 4KB sectors and 32/64KB blocks, ensuring 100k program-erase cycles endurance and 20-year data retention.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI modes with high-speed data transfer capabilities.
  • Includes hardware and software write protection mechanisms with security registers.
  • Features flexible memory architecture allowing sector and block-level erasure.
  • Provides execute-in-place (XIP) operation with continuous read support.

Memory IC Applications

  • Firmware storage in embedded systems
  • Code execution in place (XIP)
  • Data logging applications
  • Consumer electronics firmware

Memory IC Procurement Notes

Verify the specific suffix 'HIG' against official BYTe Semiconductor documentation to confirm package type and temperature range specifications. Ensure compatibility with host system voltage levels within the 2.7V to 3.6V operating range. Confirm pinout alignment for the selected package variant before integration.

Memory IC Selection Notes

Select this component for applications requiring 32M-bit non-volatile storage with high-speed SPI interface support. Consider the available package options such as SOP-8 or USON-8 based on board space constraints. Evaluate the need for Quad SPI mode if higher throughput is required compared to standard SPI operations.

Memory IC Part Context

The BY25Q32ES series belongs to BYTe Semiconductor's SPI NOR Flash family, designed for general-purpose storage. It shares architectural similarities with other devices in the BY25Qxx series but offers specific capacity and feature sets tailored for various embedded memory needs.

Memory IC Replacement Considerations

Check for direct substitutes like GD25Q32ESIG from GigaDevice, ensuring pin compatibility and electrical parameter matching. Verify that alternative components support the same SPI modes and voltage requirements.

Memory IC FAQ

What is the maximum clock frequency for Fast Read operations?

The device supports a Fast Read (Serial) clock rate of up to 120MHz with a 30pF load.

How does the /WP pin function in Quad SPI mode?

In Quad SPI mode, the /WP function is disabled and the pin acts as IO2 for bidirectional data input and output.

BY25Q32ESHIG(R)BY25Q32ESHIG(R)
$0.22
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