Memory IC BY25Q32ESWIG(R) product image

BY25Q32ESWIG(R)

$0.38
  • Description:IC FLASH 32MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:d5a0c89030f0 Category: Brand:

  
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BY25Q32ESWIG(R) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 32MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25Q32ESWIG(R)

  • Description:IC FLASH 32MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:120 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:11.5 ns

Memory IC datasheet and documents for BY25Q32ESWIG(R)

BY25Q32ESWIG(R)

Memory IC Overview

The BY25Q32ESWIG(R) is a 32 Mbit SPI NOR Flash memory manufactured by BYTe Semiconductor. It supports Standard, Dual, and Quad SPI interfaces with clock rates up to 100 MHz for normal read and 120 MHz for fast read. The device operates on a single 2.7 V to 3.6 V supply and features an 8-pin SOP package. Key specifications include 4 KByte sectors, 32/64 KByte blocks, typical 100k program-erase cycles, and 20-year data retention.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI protocols with XIP capability
  • Includes hardware and software write protection mechanisms
  • Features flexible architecture with 4K-byte sectors and 32/64K-byte blocks
  • Provides low power consumption modes including deep power-down

Memory IC Applications

  • Consumer electronics firmware storage
  • Industrial control system code execution
  • IoT device configuration and data logging
  • Automotive electronic module programming

Memory IC Procurement Notes

Verify the specific suffix 'WIG' against official datasheets to confirm pinout and package dimensions, as variations exist within the family. Ensure compatibility with host controller voltage levels (2.7V–3.6V). Confirm moisture sensitivity level (MSL) handling requirements during assembly. Cross-reference JEDEC IDs if replacing legacy components from other manufacturers.

Memory IC Selection Notes

Select this component when a 32 Mbit capacity is required with high-speed Quad SPI access. It is suitable for applications needing Execute-In-Place (XIP) functionality. Consider the 8-pin SOP package for standard surface-mount assembly. Verify that the operating temperature range meets the specific environmental constraints of the target application.

Memory IC Part Context

This part belongs to the BY25Q32ES series of Serial Peripheral Interface Flash memories. It is designed for non-volatile data storage in embedded systems. The series offers various package options and supports industry-standard commands for easy integration into existing designs requiring reliable code storage.

Memory IC Replacement Considerations

Check pin-to-pin compatibility with GD25Q32 or W25Q32 equivalents. Verify command set alignment for seamless firmware migration. Ensure voltage and temperature ranges match the original design specifications.

BY25Q32ESWIG(R)BY25Q32ESWIG(R)
$0.38
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