Memory IC BY25Q64ASHIG(R) product image

BY25Q64ASHIG(R)

$0.40
  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR)

SKU:5ef77198f7cb Category: Brand:

  
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BY25Q64ASHIG(R) is listed in the Memory IC range at ChipApex. The manufacturer field lists BYTe Semiconductor. Its product description is IC FLASH 64MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for BY25Q64ASHIG(R)

  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:-
  • Mfr:BYTe Semiconductor
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:108 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-USON (4x3)
  • Access Time:7 ns

Memory IC datasheet and documents for BY25Q64ASHIG(R)

BY25Q64ASHIG(R)

Memory IC Overview

The BY25Q64ASHIG(R) is a 64M-bit Serial Peripheral Interface (SPI) NOR Flash memory manufactured by BYTe Semiconductor. It supports standard, Dual SPI, and Quad SPI interfaces with data transfer speeds up to 432 Mbits/s in Quad I/O mode. The device operates on a single voltage supply ranging from 2.7V to 3.6V. It features flexible memory architecture with 4K-byte sectors and 32/64K-byte blocks. Key specifications include a typical page program time of 0.6ms, sector erase time of 50ms, and block erase times of 0.15s or 0.25s. The component offers software and hardware write protection mechanisms.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI communication protocols for high-speed data access
  • Includes flexible memory architecture with uniform 4K-byte sectors and 32/64K-byte blocks
  • Provides comprehensive write protection via software commands and hardware /WP pin control
  • Features low power consumption with active current of 20mA maximum and standby current of 5uA maximum

Memory IC Applications

  • Embedded systems requiring non-volatile code storage
  • Consumer electronics firmware storage
  • Industrial control system data logging
  • IoT devices needing reliable boot code retention

Memory IC Procurement Notes

Verify the specific package variant required, as the datasheet lists SOP-8, WSON, and USON options. Confirm temperature grade availability against project requirements. Ensure ordering suffixes match exact electrical and mechanical specifications. Cross-reference manufacturer part numbers with distributor listings to confirm authenticity and revision status before finalizing procurement.

Memory IC Selection Notes

Select this component when a 64M-bit capacity is needed with high-speed Quad SPI interface capabilities. Consider the operating voltage range of 2.7V to 3.6V for compatibility with host system power rails. Evaluate the need for hardware write protection if security against accidental modification is critical. Check available package types to ensure fit within the target PCB layout constraints.

Memory IC Part Context

This part belongs to the BY25Q series of SPI NOR Flash memories from BYTe Semiconductor. The series includes various densities such as 16M-bit, 32M-bit, and 128M-bit variants. These components share similar instruction sets and interface protocols, facilitating design scalability across different product lines while maintaining consistent software drivers and hardware connections.

Memory IC Replacement Considerations

Compatible substitutes include GD25Q64E, W25Q64JV, and MX25L6406E. Verify pinout compatibility and voltage levels before substitution. Ensure that the replacement part supports the required Quad SPI mode if high-speed performance is necessary. Confirm that the alternative component meets the same temperature and endurance specifications.

BY25Q64ASHIG(R)BY25Q64ASHIG(R)
$0.40
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