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The BYG10GHE3_A/H is a single standard recovery rectifier manufactured by Vishay Semiconductors. It features an 800 V reverse voltage rating and supports a continuous forward current of 1.5 A. The device utilizes the DO-214AC-2 (SMA) surface-mount package. Key electrical parameters include a maximum forward voltage of 1.15 V, a reverse leakage current of 1 uA, and a typical recovery time of 4 us. It withstands a maximum surge current of 30 A and operates within a junction temperature range of -55 C to +150 C. The component holds AEC-Q101 qualification for automotive applications.
Verify the specific suffix against official Vishay documentation to confirm exact binning or tape-and-reel specifications. Ensure the procurement channel provides valid traceability records for AEC-Q101 qualified components. Confirm that the received parts match the DO-214AC-2 package dimensions and marking codes specified in the manufacturer datasheet before integration into production lines.
Select this component when a standard recovery speed is sufficient for the application frequency requirements. The 800 V rating provides adequate margin for high-voltage AC-to-DC conversion stages. Consider the 1.5 A current capacity relative to thermal management constraints in the SMA package. Verify that the 4 us recovery time aligns with switching losses acceptable for the target circuit topology.
This part belongs to the BYG10 series of surface-mount rectifiers from Vishay. The series offers various voltage ratings while maintaining consistent current handling capabilities. The A/H suffix typically denotes specific packaging or environmental compliance attributes defined by the manufacturer. These devices are designed to replace through-hole equivalents in space-constrained modern PCB layouts.
Direct substitutes include other Vishay BYG10 series variants with matching voltage and current ratings, such as BYG10JHE3_A/H or BYG10MHE3_A/H, provided the reverse voltage requirements are met. Cross-brand replacements must be verified for identical pinout compatibility and thermal performance characteristics.