ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：DIODE AVALANCHE 1KV 1.5A DO214AC
- Series：-
- Mfr：Vishay General Semiconductor - Diodes Division
- Package：Tape & Reel (TR)
- Technology：Avalanche
- Voltage - DC Reverse (Vr) (Max)：1000 V
- Current - Average Rectified (Io)：1.5A
- Voltage - Forward (Vf) (Max) @ If：1.15 V @ 1.5 A
- Speed：Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：4 µs
- Current - Reverse Leakage @ Vr：1 µA @ 1000 V
- Capacitance @ Vr, F：-
- Mounting Type：Surface Mount
- Package / Case：DO-214AC, SMA
- Supplier Device Package：DO-214AC (SMA)
- Operating Temperature - Junction：-55°C ~ 150°C
- Grade：Automotive
- Qualification：AEC-Q101
Download product information
Overview
The BYG10MHM3_A/H is a standard avalanche surface mount rectifier manufactured by Vishay General Semiconductor. It features a glass passivated chip junction and operates in the SMA (DO-214AC) package. The device supports an average forward current of 1.5 A and a maximum repetitive peak reverse voltage of 1000 V. Key electrical parameters include a maximum instantaneous forward voltage of 1.15 V at 1.5 A, a maximum DC reverse current of 1 μA at 25 °C, and a maximum reverse recovery time of 4 μs. It withstands a peak forward surge current of 30 A and handles up to 20 mJ of non-repetitive pulse energy in avalanche mode. The component is rated for operating junction and storage temperatures ranging from -55 °C to +150 °C.
Feature Summary
- Controlled avalanche characteristics allow safe operation during inductive load switching events.
- Glass passivated pellet chip junction ensures stable performance and low leakage current.
- Low profile package design facilitates automated placement on printed circuit boards.
Applications
- General purpose rectification in power supplies
- Freewheeling diodes for consumer electronics
- Inverter and converter circuits
Procurement Notes
Verify that the specific ordering code matches the required automotive qualification status. Confirm the suffix indicates halogen-free compliance and RoHS adherence. Ensure the package type corresponds to the SMA (DO-214AC) footprint requirements for your assembly process.
Selection Notes
Select this component when high reverse voltage blocking capability is required alongside controlled avalanche ruggedness. The SMA package offers a compact solution for space-constrained designs. Verify thermal resistance limits against your ambient temperature conditions to ensure reliable operation within the specified junction temperature range.
Part Context
This part belongs to the BYG10 series of standard avalanche SMD rectifiers. The series includes variants with different reverse voltage ratings, such as 200 V, 400 V, 600 V, 800 V, and 1600 V. All variants share similar mechanical dimensions and thermal characteristics while differing in their peak reverse voltage specifications.
Replacement Considerations
Direct substitutes within the same family include BYG10D, BYG10G, BYG10J, BYG10K, and BYG10Y, provided their reverse voltage ratings meet or exceed the circuit requirements. Cross-brand replacements must match the DO-214AC package, 1.5 A current rating, and 1000 V blocking voltage.
FAQ
What is the maximum pulse energy the BYG10MHM3_A/H can handle in avalanche mode?
The device can withstand a non-repetitive pulse energy of 20 mJ in avalanche mode when the avalanche current is 1 A and the junction temperature is 25 °C.
Does the BYG10MHM3_A/H support automated placement?
Yes, the low profile SMA package is designed to be ideal for automated placement processes.
