BYG20D-E3/TR

Overview

The BYG20D-E3/TR is a silicon avalanche rectifier diode manufactured by Vishay General Semiconductor. It features a maximum repetitive peak reverse voltage of 200 V and an average forward rectified current of 1.5 A. The device utilizes a DO-214AC (SMA) surface-mount package. Key electrical parameters include a maximum non-repetitive peak forward surge current of 60 A, a typical reverse recovery time of 75 ns, and a maximum DC reverse leakage current of 1 µA at 400 V. The forward voltage drop is specified as 1.4 V at 1.5 A. The component operates within a junction temperature range of -55°C to 150°C.

Feature Summary

• Incorporates avalanche technology for robust operation under transient conditions.
• Features fast recovery characteristics suitable for high-frequency switching applications.
• Utilizes a cavity-free glass-passivated junction structure for enhanced reliability.

Applications

• High-frequency rectification in power supply circuits
• Free-wheeling diode applications in inductive load protection
• General-purpose rectification in compact surface-mount designs

Procurement Notes

Verify the specific suffix against official manufacturer documentation to confirm tape-and-reel packaging quantities and lead times. Ensure compliance with RoHS directives and environmental standards required for your assembly process. Cross-reference the full part number with authorized distributors to validate authenticity and traceability before procurement.

Selection Notes

Select this component when a surface-mount solution is required for 1.5 A rectification with 200 V blocking capability. The fast recovery time makes it suitable for higher frequency operations compared to standard rectifiers. Consider the thermal management requirements associated with the SMA package and the specified junction temperature limits during circuit design.

Part Context

This component belongs to the BYG series of fast recovery avalanche rectifiers from Vishay. The series offers various voltage ratings while maintaining consistent current handling capabilities. The DO-214AC package provides a compact footprint for modern PCB layouts. This specific variant targets applications requiring reliable performance in space-constrained environments.

Replacement Considerations

Consult official substitution guides for equivalent parts with matching voltage, current, and package specifications. Verify that any alternative component meets the same fast recovery and avalanche rating requirements. Ensure compatibility with existing board space and thermal constraints before implementing a substitute.