BYG21M/54

Overview

The BYG21M/54 is a fast avalanche surface-mount rectifier diode manufactured by Vishay General Semiconductor. It features a silicon construction with a glass passivated junction, housed in the low-profile DO-214AC (SMA) package. The device is rated for a maximum repetitive peak reverse voltage of 1000 V and an average forward rectified current of 1.5 A. Key electrical characteristics include a maximum non-repetitive peak forward surge current of 30 A, a maximum forward voltage of 1.5 V, and a maximum reverse recovery time of 0.12 µs. It operates within a junction temperature range of -65 °C to 150 °C.

Feature Summary

• Fast reverse recovery time with soft recovery characteristic
• Avalanche ruggedness capability
• Glass passivated junction for enhanced reliability
• Low profile package suitable for automated placement

Applications

• High frequency rectification circuits
• Free-wheeling diodes in switching power supplies
• DC-DC converter output rectification
• General purpose high speed rectification

Procurement Notes

Verify the specific suffix /54 against the official Vishay datasheet to confirm the tape and reel packaging configuration. Ensure the component meets RoHS directives if required by the design specification. Confirm that the AEC-Q101 qualification status aligns with automotive application requirements. Cross-reference the DO-214AC footprint dimensions with the PCB layout to ensure mechanical compatibility.

Selection Notes

Select this component for applications requiring high voltage blocking capability combined with fast switching speeds. The 1.5 A current rating suits moderate power levels where space constraints favor surface mount technology. Consider the 1000 V reverse voltage rating for mains-derived or high-side rectification tasks. Evaluate the thermal management needs given the 150 °C maximum junction temperature limit.

Part Context

This part belongs to the BYG series of fast avalanche rectifiers from Vishay. These devices are designed for high efficiency and reliability in compact electronic systems. The series utilizes advanced silicon planar technology to achieve low leakage currents and consistent performance across temperature variations. The DO-214AC package provides a balance between current handling capacity and board space efficiency.

Replacement Considerations

Check for direct equivalents such as the BYG21K variant which shares similar electrical specifications but may differ in specific avalanche ratings or packaging tolerances. Verify pinout compatibility and thermal resistance values when substituting with other SMA packaged fast recovery diodes from different manufacturers.