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Product Detailed Parameters
- Description：DIODE AVALANCHE 1KV 1.5A DO214AC
- Series：-
- Mfr：Taiwan Semiconductor Corporation
- Package：Tape & Reel (TR),Cut Tape (CT)
- Technology：Avalanche
- Voltage - DC Reverse (Vr) (Max)：1000 V
- Current - Average Rectified (Io)：1.5A
- Voltage - Forward (Vf) (Max) @ If：1.6 V @ 1.5 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：120 ns
- Current - Reverse Leakage @ Vr：1 µA @ 1000 V
- Capacitance @ Vr, F：13pF @ 4V, 1MHz
- Mounting Type：Surface Mount
- Package / Case：DO-214AC, SMA
- Supplier Device Package：DO-214AC (SMA)
- Operating Temperature - Junction：-55°C ~ 150°C
- Grade：-
- Qualification：-
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Overview
The BYG21M is a 1.5A, 1000V fast avalanche surface mount rectifier in the DO-214AC (SMA) package. It features glass passivated chip junctions and supports a repetitive peak reverse voltage of 1000V with a forward current of 1.5A. The device exhibits a peak forward surge current capability of 50A and operates within a junction temperature range of -55°C to +150°C. Electrical characteristics include a maximum reverse current of 50µA at 125°C and a typical reverse recovery time of 120ns.
Feature Summary
- Glass passivated chip junction for enhanced reliability
- Fast switching performance optimized for high efficiency
- Superior avalanche capability suitable for energy absorption applications
Applications
- Free-wheeling circuits in power supplies
- Clamping applications in power switching systems
- Snubber circuits for transient suppression
- Demagnetization tasks in inductive loads
Procurement Notes
Verify the specific ordering code against the manufacturer's official documentation to ensure correct package type and packing configuration. Confirm that the component meets RoHS compliance and halogen-free requirements as specified in the datasheet. Check for moisture sensitivity level 1 classification per J-STD-020 standards before integration into assembly processes.
Selection Notes
Select this component for designs requiring high reverse voltage blocking and fast recovery characteristics in a compact surface mount form factor. Ensure the thermal management strategy accounts for the junction-to-ambient thermal resistance values provided. Validate that the application current does not exceed the rated average forward current under all operating conditions.
Part Context
This device belongs to the BYG series of fast avalanche rectifiers manufactured by Taiwan Semiconductor Corporation. It utilizes the DO-214AC (SMA) surface mount case style, which is standard for automated placement. The marking code on the device body corresponds directly to the part number BYG21M for identification purposes.
Replacement Considerations
Consult official substitution guides for compatible parts within the same family or equivalent specifications from other manufacturers. Verify pinout compatibility and electrical parameter alignment before replacing existing components in established designs.
