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The BYG23MH is a high-efficient surface mount rectifier manufactured by Taiwan Semiconductor Corporation. It features a single die configuration housed in a DO-214AC (SMA) package. Key electrical parameters include a repetitive peak reverse voltage of 1000 V, an average forward current of 1.5 A, and a peak forward surge current of 50 A. The device exhibits a maximum reverse recovery time of 65 ns and a typical junction-to-ambient thermal resistance of 70 °C/W. It operates within a junction temperature range of -55 to +150 °C.
Verify the specific ordering code BYG23MH against the manufacturer's datasheet version A2102 to ensure correct package and packing specifications. Confirm that the required quantity aligns with the standard tape and reel packaging of 7,500 units per reel. Ensure compliance with RoHS and halogen-free requirements as documented in the official product specifications before finalizing procurement orders.
Select the BYG23MH when designing circuits requiring high-voltage rectification up to 1000 V with moderate current handling at 1.5 A. Its fast switching characteristics make it appropriate for high-efficiency power conversion topologies. Consider the DO-214AC package dimensions for PCB layout constraints and verify thermal management capabilities given the 70 °C/W junction-to-ambient resistance under rated operating conditions.
This component belongs to the BYG series of high-efficient surface mount rectifiers produced by Taiwan Semiconductor. The series targets applications demanding reliable performance in compact form factors. The BYG23MH specifically addresses needs for higher voltage ratings compared to lower-voltage variants within the same family, maintaining consistent mechanical and electrical interface standards across the product line.
Public confirmed substitute part numbers are not available in the provided documentation.