BYVB32-200-M3/I

Diode Arrays Overview

The BYVB32-200-M3/I is a dual common-cathode ultrafast rectifier manufactured by Vishay General Semiconductor. It utilizes a glass passivated pellet chip junction and operates within a temperature range of -65 °C to +150 °C. The device features an average forward rectified current of 18 A, a maximum repetitive peak reverse voltage of 200 V, and a peak forward surge current of 150 A. Electrical characteristics include a maximum instantaneous forward voltage of 1.15 V at 20 A and a typical reverse recovery time of 25 ns. It is housed in a D2PAK (TO-263AB) surface-mount package.

Diode Arrays Feature Summary

• Ultrafast recovery time with low switching losses for high efficiency
• Glass passivated pellet chip junction construction
• High forward surge current capability
• Low forward voltage drop

Diode Arrays Applications

• High frequency rectification in switching mode power supplies
• Inverter circuits
• Freewheeling diodes
• DC/DC converters
• General power switching applications

Diode Arrays Procurement Notes

Verify the specific ordering code against the manufacturer's documentation to ensure correct package type and compliance status. Confirm that the M3 suffix indicates halogen-free RoHS compliance. Check for automotive qualification requirements if AEC-Q101 certification is necessary for the intended application environment.

Diode Arrays Selection Notes

Select this component for designs requiring fast recovery characteristics and high thermal stability. Ensure the operating case temperature does not exceed limits defined in the derating curves. Verify that the required reverse voltage rating accommodates peak line voltages and transients present in the target circuit topology.

Diode Arrays Part Context

This part belongs to the BYV32 series of dual common-cathode ultrafast rectifiers. The series includes variants with different voltage ratings and packages such as TO-220AB and ITO-220AB. The BYVB32 variant specifically denotes the D2PAK (TO-263AB) surface-mount configuration designed for automated assembly processes.

Diode Arrays Replacement Considerations

Direct substitutes within the same family include BYVF32-200-M3/I for the ITO-220AB package or BYV32-200-M3/I for the TO-220AB through-hole package. Cross-package replacements require verification of footprint compatibility and thermal management capabilities.