BZB84-C24,215

Overview

The Nexperia BZB84-C24,215 is a dual Zener diode in a SOT-23 (TO-236AB) plastic surface-mounted device package. It features a dual common anode configuration with two independent cathodes and one shared anode pin. The nominal Zener voltage is 24 V with a ±5% tolerance. Total power dissipation is 300 mW per device. Key electrical parameters include a maximum reverse current of 70 μA at IZ=1 mA, a differential resistance of 70 Ω at IZ=5 mA, and a temperature coefficient of 18.4 mV/K. The junction-to-ambient thermal resistance is 417 K/W.

Feature Summary

• Dual common anode configuration for compact circuit design
• Qualified to AEC-Q101 automotive standards
• Small SOT-23 plastic package suitable for surface mounting

Applications

• General regulation functions

Procurement Notes

Verify the specific ordering suffix matches the required manufacturing origin code. Confirm RoHS compliance status through official documentation before integration. Ensure the component version aligns with the latest product data sheet revision to avoid discrepancies in limiting values or thermal characteristics during final validation.

Selection Notes

Select this part when a dual Zener solution with a common anode is required in a small footprint. The C-series offers a wider voltage tolerance compared to the B-series. Verify that the 24 V nominal voltage and 300 mW total power dissipation meet the specific circuit requirements for both individual diodes within the package.

Part Context

This component belongs to the Nexperia BZB84 series of dual Zener diodes. The series provides various nominal working voltages ranging from 2.4 V to 75 V. The BZB84-C24,215 specifically utilizes the C-tolerance variant, offering ±5% accuracy, which is distinct from the tighter ±2% tolerance found in the B-series counterparts within the same package family.

Replacement Considerations

Direct substitutes within the same series include BZB84-B24,215 for tighter tolerance or other BZB84-C variants for different voltage levels. Cross-package replacements require verifying pin compatibility and thermal performance constraints.