BZB984-C10,115

Overview

The Nexperia BZB984-C10,115 is a dual voltage regulator diode in an SOT-663 surface-mount package. It features a nominal Zener voltage of 10 V with a ±5% tolerance and a maximum differential resistance of 20 Ω at IZ = 5 mA. The device supports a total power dissipation of 425 mW (two diodes loaded) or 265 mW per diode. Key electrical parameters include a forward voltage of 0.9 V max at IF = 10 mA, a reverse current of 150 μA max at VR = 10 V, and a temperature coefficient of 6.0 mV/K at IZtest = 5 mA. Operating temperatures range from -55 °C to +150 °C.

Feature Summary

• Dual common-anode configuration for compact circuit design
• Ultra-small flat plastic SMD package suitable for high-density layouts
• Narrow working-voltage tolerances for precise regulation

Applications

• General regulation functions
• ESD and surge protection

Procurement Notes

Verify the specific ordering suffix matches the required tape-and-reel quantity. Confirm that the application environment remains within the specified non-automotive thermal limits. Ensure PCB footprint aligns with the SOT-663 standard dimensions provided in the datasheet to maintain reliable soldering integrity during assembly.

Selection Notes

Select this component when space constraints require a dual-diode solution in the SOT-663 form factor. Verify that the 10 V nominal voltage aligns with the target reference level. Check that the 20 Ω differential resistance meets the ripple rejection requirements of the specific circuit topology being implemented.

Part Context

This part belongs to the BZB984 series, which offers a comprehensive range of nominal voltages from 2.4 V to 15 V. All variants share the same SOT-663 package and pinout, allowing for design flexibility while maintaining consistent board layout requirements across different voltage reference needs.

Replacement Considerations

Direct substitutes within the same series include BZB984-C9V1,115 and BZB984-C11,115 if voltage adjustments are permissible. Cross-package replacements require re-evaluation of thermal performance and footprint compatibility.