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BZX584C36L-TP is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is ZENER DIODES,300MW 36V, SOD-523. Review the specifications below when checking this part for your BOM.
The BZX584C36L-TP is a dual Zener diode in a common anode configuration, manufactured by Micro Commercial Components (MCC). It operates within a voltage range of 2 to 47 Volts and features a maximum power dissipation of 200 mW. The device utilizes an SOD-523 package with dimensions of 1.1mm x 0.8mm x 0.6mm. Electrical specifications for the 36V variant include a Zener voltage range of 34.20V to 37.80V at a test current of 5mA. Maximum Zener impedance is 80Ω at IZT and 220Ω at IZK. The component supports an operating junction temperature range from -55°C to +150°C.
Verify authenticity through authorized MCC distributors to avoid counterfeit components. Confirm RoHS compliance status via official documentation. Ensure storage conditions adhere to manufacturer guidelines for moisture-sensitive devices. Check specific ordering suffixes for packaging variations. Validate electrical parameters against the latest datasheet revisions before integration.
Select this component when space-constrained designs require two matched Zener diodes. The SOD-523 package offers compact surface-mount integration. Consider the 200mW power rating for thermal management requirements. Verify that the 36V breakdown voltage aligns with circuit protection thresholds. Evaluate the 80Ω impedance specification for noise sensitivity in the target application.
This part belongs to the BZX584C series of dual Zener diodes produced by Micro Commercial Components. The series covers voltages from 2V to 47V in the SOD-523 package. The 'L' suffix indicates the specific voltage binning code for the 36V variant. The '-TP' suffix denotes tape and reel packaging containing 8000 pieces per reel.
Cross-reference with other dual common anode Zener diodes in SOD-523 packages. Verify pinout compatibility and thermal resistance characteristics. Ensure equivalent voltage tolerance and impedance values are maintained. Confirm package dimensions match existing PCB footprints.
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