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BZX84C18-7-F-79 is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is DIODE ZENER 18V 300MW SOT23. Review the specifications below when checking this part for your BOM.
The BZX84C18-7-F-79 is a surface-mount Zener diode manufactured by Diodes Incorporated, housed in an SOT-23-3 package. It features a nominal Zener voltage of 18V with a power dissipation rating of 300mW (0.35W). The device exhibits a reverse leakage current of 100nA and operates within a temperature range of -65°C to +150°C. Designed for compact circuit applications, it provides stable voltage regulation in small form-factor designs.
Verify the exact suffix designation against the manufacturer's official documentation to confirm specific tape-and-reel or cut-tape configurations. Ensure that the ordering code matches the required packaging format for automated assembly processes. Cross-reference the component marking with the datasheet to authenticate the source and prevent counterfeit substitution during procurement.
Select this component when a low-profile Zener diode is required for 18V regulation in SOT-23-3 compatible footprints. Consider the 300mW power rating for thermal management in dense PCB layouts. Verify that the 100nA leakage current meets the sensitivity requirements of the specific application circuit before finalizing the design.
This part belongs to the BZX84 series of single Zener diodes from Diodes Incorporated. The series is characterized by its use in general-purpose voltage regulation and protection roles. The SOT-23-3 package allows for high-density mounting on printed circuit boards, making it suitable for modern consumer and industrial electronic devices requiring reliable voltage clamping.
Direct substitutes include other 18V Zener diodes in SOT-23 packages from different manufacturers, provided they match the 300mW power dissipation and 18V nominal voltage specifications. Verify pinout compatibility and thermal characteristics before implementing any alternative component in the existing design.
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