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The C021-5352/D is a cylindrical heat sink manufactured by Boyd Laconia, LLC, designed for TO-5 package components. Constructed from aluminum with a black anodized surface finish, it provides thermal management capabilities rated at 1.0W dissipation at 60°C. The unit utilizes a top-mount installation method and features a compact cylindrical geometry suitable for space-constrained applications requiring efficient passive cooling.
Verify the exact thermal resistance values and dimensional tolerances against the official manufacturer datasheet before integration. Confirm that the TO-5 footprint matches the target component's lead configuration. Ensure the black anodized finish meets environmental requirements for the intended operating conditions.
Select this component when a cylindrical form factor is required for TO-5 packages. Evaluate the 1.0W @ 60°C rating against the specific power dissipation needs of the application. Consider the top-mount orientation constraints during PCB layout design to ensure adequate clearance for airflow and assembly.
This part belongs to Boyd Laconia's thermal management portfolio, focusing on standardized heatsink solutions for through-hole and specialized package types. It represents a passive cooling solution within their broader range of thermal accessories and heat sinks designed for various semiconductor packages.
No direct substitute part numbers are documented in the provided source material. Verify compatibility with existing mechanical fixtures if replacing similar cylindrical units.
It is designed for top-mount installation onto TO-5 components.
The heat sink is constructed from aluminum with a black anodized surface finish.