C021-5352/D

C021-5352/D

  • Description:C021-5352,RV D,00,04
  • Series:*
  • Mfr:Boyd Laconia, LLC
  • Package:Bulk

SKU:76912d64d615 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:C021-5352,RV D,00,04
  • Series:*
  • Mfr:Boyd Laconia, LLC
  • Package:Bulk

Download product information

C021-5352/D

Overview

The C021-5352/D is a cylindrical heat sink manufactured by Boyd Laconia, LLC, designed for TO-5 package components. Constructed from aluminum with a black anodized surface finish, it provides thermal management capabilities rated at 1.0W dissipation at 60°C. The unit utilizes a top-mount installation method and features a compact cylindrical geometry suitable for space-constrained applications requiring efficient passive cooling.

Feature Summary

  • Cylindrical fin structure optimized for radial heat dissipation
  • Black anodized aluminum construction for corrosion resistance
  • Designed specifically for TO-5 component mounting

Applications

  • Thermal management for TO-5 packaged electronic components
  • Passive cooling in compact industrial electronics
  • High-reliability circuit protection modules

Procurement Notes

Verify the exact thermal resistance values and dimensional tolerances against the official manufacturer datasheet before integration. Confirm that the TO-5 footprint matches the target component's lead configuration. Ensure the black anodized finish meets environmental requirements for the intended operating conditions.

Selection Notes

Select this component when a cylindrical form factor is required for TO-5 packages. Evaluate the 1.0W @ 60°C rating against the specific power dissipation needs of the application. Consider the top-mount orientation constraints during PCB layout design to ensure adequate clearance for airflow and assembly.

Part Context

This part belongs to Boyd Laconia's thermal management portfolio, focusing on standardized heatsink solutions for through-hole and specialized package types. It represents a passive cooling solution within their broader range of thermal accessories and heat sinks designed for various semiconductor packages.

Replacement Considerations

No direct substitute part numbers are documented in the provided source material. Verify compatibility with existing mechanical fixtures if replacing similar cylindrical units.

FAQ

What is the primary mounting method for this heat sink?

It is designed for top-mount installation onto TO-5 components.

What material is used for the C021-5352/D heat sink?

The heat sink is constructed from aluminum with a black anodized surface finish.

C021-5352/DC021-5352/D

Click on the inquiry