C1E-27.120-8-3030-R

Crystals Overview

The C1E-27.120-8-3030-R is a surface-mount quartz crystal oscillator manufactured by Aker Technology Corp. It operates at a standard frequency of 27.12 MHz with a frequency tolerance and stability of ±30 ppm. The component features an 8 pF load capacitance and a series resistance of 100 Ohms. It utilizes a 4-pin SMD package with dimensions of 3.2 mm in length, 2.5 mm in width, and 0.75 mm in height. The device supports an operating temperature range from -40°C to 85°C and complies with RoHS standards.

Crystals Feature Summary

• Surface-mount design for automated assembly
• High frequency stability within specified temperature range
• Compliant with RoHS environmental standards

Crystals Applications

• General purpose clock generation circuits
• Microcontroller system timing references
• Communication module oscillators

Crystals Procurement Notes

Verify the manufacturer part number matches exactly C1E-27.120-8-3030-R. Confirm the load capacitance is 8pF and frequency is 27.12MHz. Check for RoHS compliance status. Ensure the package type is 4-SMD No Lead. Validate the operating temperature range requirements against application needs.

Crystals Selection Notes

Select this component when a 27.12 MHz reference is required for space-constrained designs. The 3.2mm x 2.5mm footprint suits compact PCB layouts. Consider the ±30 ppm tolerance for applications not requiring high precision. Verify that the 8pF load capacitance matches the circuit design requirements.

Crystals Part Context

This part belongs to the C1E series of surface-mount crystals from Aker Technology Corp. It provides a stable frequency reference for digital systems. The series offers various frequencies and package sizes. This specific model targets general electronics applications requiring reliable timing signals.

Crystals Replacement Considerations

Compatible substitutes include other 27.12 MHz SMD crystals with similar electrical parameters. Ensure equivalent load capacitance and frequency tolerance. Verify package dimensions match the existing footprint. Check thermal characteristics for compatibility.