C3E-12.000-18-1015-R

Crystals Overview

The C3E-12.000-18-1015-R is a surface-mount crystal oscillator manufactured by Aker Technology Corp. It operates at a nominal frequency of 12 MHz with a load capacitance of 18 pF and an equivalent series resistance (ESR) of 100 Ohms. The component utilizes a 4-SMD, No Lead package configuration, specifically designed for compact electronic assemblies. This unit provides stable timing signals suitable for various digital circuit applications requiring precise clock synchronization.

Crystals Feature Summary

• Surface-mount design for automated assembly integration
• Seam-sealed construction for environmental protection
• Standardized 4-pad footprint for PCB compatibility

Crystals Applications

• Digital clock signal generation in microcontroller systems
• Timing reference for communication interfaces
• Frequency control in consumer electronics devices

Crystals Procurement Notes

Verify the specific suffix 'R' against the manufacturer's current datasheet to confirm packaging details and availability status. Ensure that the 18 pF load capacitance requirement matches the target circuit design specifications before finalizing procurement decisions.

Crystals Selection Notes

Select this component when a 12 MHz frequency stability is required within a compact SMD form factor. Confirm that the 100 Ohm ESR value aligns with the oscillator circuit's drive level requirements and that the 4-SMD package fits the designated PCB layout constraints.

Crystals Part Context

This part belongs to the C3E series of seam-sealed crystals from Aker Technology Corp. The series typically includes variants with different frequencies and load capacitances, sharing common physical dimensions and mounting characteristics while varying in electrical performance parameters.

Crystals Replacement Considerations

Cross-reference with other 12 MHz SMD crystals offering 18 pF load capacitance and similar ESR values. Verify pinout compatibility and mechanical footprint alignment to ensure direct substitution without PCB redesign.