C503C-WAN-CBBDB231

Overview

The C503C-WAN-CBBDB231 is a high-power LED module from Cree's XLamp series, designed for demanding commercial and industrial lighting applications. It features a robust ceramic substrate for superior thermal management and electrical isolation. The component integrates multiple LED chips on a single board to deliver high luminous flux in a compact form factor. This specific configuration utilizes a warm white color point with a defined correlated color temperature and chromaticity coordinates to ensure consistent light quality across production batches.

Feature Summary

• Integrated multi-chip architecture for enhanced luminous output
• Ceramic substrate construction providing excellent thermal dissipation capabilities
• Designed for high reliability in continuous operation environments

Applications

• Commercial area lighting fixtures
• Industrial high-bay lighting systems
• Outdoor street lighting luminaires

Procurement Notes

Verify the exact binning codes and forward voltage specifications against the manufacturer's latest datasheet before integration. Ensure thermal interface materials are compatible with the ceramic substrate surface finish. Confirm that the driving current matches the rated specifications to maintain longevity and optical performance standards.

Selection Notes

Select this module based on required lumen output and thermal constraints of the final luminaire design. Evaluate the spatial distribution requirements as the emission pattern is determined by the chip arrangement. Consider the mounting orientation relative to heat sink surfaces to optimize thermal resistance and ensure stable junction temperatures during operation.

Part Context

This part belongs to the XLamp C503C family, which represents a generation of high-density LED modules. These components are engineered to replace traditional high-intensity discharge lamps in retrofit and new design scenarios. The family emphasizes improved efficacy and reduced package size compared to earlier discrete LED solutions.

Replacement Considerations

Direct replacements must match the footprint, pinout, and thermal characteristics. Verify that substitute parts meet the same chromaticity binning requirements to avoid visible color variation in assembled arrays. Consult official substitution guides for electrically equivalent alternatives.