C57401AW883B

FIFOs Memory Overview

The C57401AW883B is an asynchronous FIFO memory integrated circuit manufactured by Monolithic Memories. It features a 64-word by 4-bit organization and operates with TTL logic levels. The device is housed in a ceramic flatpack package (CDFP16) with 16 terminals. It supports a maximum clock frequency of 10 MHz and functions within a temperature range of -55 °C to 125 °C. The unit requires a 5 V supply voltage and has a maximum power supply current of 0.18 mA. It meets MIL-STD-883B qualification standards.

FIFOs Memory Feature Summary

• Asynchronous operation mode for independent read and write clocks
• TTL-compatible logic interface
• Military-grade reliability with extended temperature capability

FIFOs Memory Applications

• High-reliability military data buffering systems
• Spacecraft avionics memory interfaces
• Industrial control systems requiring wide temperature tolerance

FIFOs Memory Procurement Notes

Verify the manufacturer designation, as this part number originates from Monolithic Memories. Confirm that the MIL-STD-883B screening level matches specific program requirements. Ensure the ceramic flatpack package form factor is compatible with existing board layouts and socketing mechanisms. Validate that TTL input/output compatibility aligns with the system's logic family constraints.

FIFOs Memory Selection Notes

Select this component when asynchronous FIFO functionality with TTL compatibility is required in harsh environments. The 64x4 depth suits small buffer applications where low latency is critical. Consider the ceramic package for superior thermal and mechanical stability compared to plastic alternatives. Verify that the 10 MHz speed meets the system's throughput requirements without necessitating faster, more expensive alternatives.

FIFOs Memory Part Context

This component belongs to the class of asynchronous first-in-first-out memories designed for robust digital signal processing and data storage tasks. Manufactured by Monolithic Memories, it represents a legacy high-reliability solution often utilized in defense and aerospace sectors where long-term availability and proven performance under extreme conditions are prioritized over modern high-density integration.

FIFOs Memory Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.