C5SMF-BJE-CR0U0452

Overview

The C5SMF-BJE-CR0U0452 is a single-color blue LED from the Cree Screen Master family, designed for through-hole mounting in a T-1 3/4 (5 mm) oval package. It emits light at a wavelength of 470 nm with a luminous intensity of 1100 mcd. The component operates with a forward current of 20 mA and a forward voltage of 3.4 V, featuring a power rating of 140 mW. The lens is tinted blue with clear transparency, measuring 5.1 mm x 3.7 mm.

Feature Summary

• Oval-shaped radiation pattern optimized for wide viewing angles
• High luminous intensity suitable for visible signage applications
• Through-hole construction for standard PCB integration

Applications

• Variable-message signs
• Passenger-information displays
• Public transit indicator panels

Procurement Notes

Verify component authenticity against official Cree LED datasheets due to potential availability constraints. Confirm RoHS compliance status prior to procurement. Ensure storage conditions maintain lead integrity. Validate package dimensions against design specifications before finalizing supply chain agreements.

Selection Notes

Select this component when an oval beam profile is required for wide-area visibility in signage. Compare forward voltage requirements against circuit design limits. Consider thermal management capabilities within the 140 mW power rating. Evaluate mechanical fit within the T-1 3/4 housing constraint for the specific enclosure design.

Part Context

This part belongs to the Screen Master series, which specializes in high-intensity LEDs for large-format displays. The C5SMF-BJE variant specifically utilizes a blue tinted lens to enhance contrast in bright ambient environments. It shares the standard 5 mm oval footprint common across the family for interchangeability in existing tooling.

Replacement Considerations

Direct substitutes include other C5SMF-BJE variants with different binning codes or lens tints. Verify electrical parameters match exactly before substitution. Cross-reference package dimensions to ensure mechanical compatibility without redesigning the PCB footprint.