C8051F326-GDI

Overview

The C8051F326-GDI is a tested die in wafer form from the Silicon Labs C8051F32x family. It features an 8051 core with up to 25 MIPS throughput at 25 MHz. The device includes 16 kB of Flash memory and 1536 bytes of internal RAM. It integrates a USB 2.0 function controller supporting full-speed (12 Mbps) or low-speed (1.5 Mbps) operation with an integrated transceiver and clock recovery. Operating voltage ranges from 2.7 V to 5.25 V, utilizing an on-chip regulator for higher voltages. It provides 15 digital I/Os, all 5 V tolerant.

Feature Summary

• Integrated USB 2.0 function controller with built-in transceiver and clock recovery, eliminating external components.
• High-speed pipelined 8051 microcontroller core delivering up to 25 MIPS performance.
• On-chip debug circuitry enabling full-speed, non-intrusive in-system debugging without external emulators.
• Internal oscillator with high accuracy supports USB and UART modes, allowing on-the-fly clock source switching.

Applications

• Embedded USB connectivity implementations
• In-system programming applications
• Low-power designs requiring clock source switching

Procurement Notes

Verify that the procurement channel supplies actual bare dies rather than packaged units, as this part number denotes tested die in wafer form. Confirm specific wafer handling requirements, including storage temperature between 18–24 °C and humidity below 30%. Ensure manufacturing processes accommodate the 60 µm bond pad pitch and maximum processing temperature of 250 °C during assembly.

Selection Notes

Select this component when a system requires direct integration of a silicon die into custom substrates or advanced packaging solutions. It is suitable for designs needing USB functionality with minimal external bill of materials. Consider the 28-pin QFP pinout mapping if designing custom interconnects. Verify that the application can support the specific wafer storage and handling protocols required for bare die reliability.

Part Context

This component belongs to the C8051F32x/34x series of USB microcontrollers from Silicon Labs. These devices are designed to simplify USB implementation by integrating the function controller and transceiver on-chip. The series offers varying memory sizes and package options, with the F326 providing 16 kB Flash. The GDI suffix specifically indicates the tested die configuration available in wafer form.

Replacement Considerations

Consult the official product selection guide for alternative part numbers within the C8051F32x family that offer different memory capacities or package types. Verify compatibility with existing software architectures due to potential peripheral variations across the series.