C8051F715-GM

Overview

The C8051F715-GM is a mixed-signal ISP Flash microcontroller from Silicon Labs, featuring an 8051 core with up to 25 MIPS throughput at a 25 MHz clock. It includes 8 kB of in-system programmable Flash memory and 512 bytes of internal data RAM. The device integrates a capacitance-to-digital converter supporting up to 38 input channels for touch sensing applications. It operates within a supply voltage range of 1.8 V to 3.6 V and supports industrial temperature ranges from -40 °C to +85 °C.

Feature Summary

• Integrates a capacitance-to-digital converter for capacitive proximity and touch screen sensing
• Features a high-speed pipelined 8051 core executing instructions in one or two system clocks
• Includes on-chip debug circuitry for full-speed non-intrusive in-system debugging
• Supports hardware-enhanced UART, SMBus, and SPI serial communication interfaces

Applications

• Capacitive button and slider sensing systems
• Touch screen interface controllers
• Capacitive proximity detection devices
• Industrial control units requiring low-voltage operation

Procurement Notes

Verify the component status as Not Recommended for New Designs before implementation. Confirm package specifications match the TQFP-48 variant. Ensure design reviews account for the specific memory configuration of the C8051F71x series. Validate that the supplier documentation aligns with the official Silicon Labs datasheet Rev. 1.0.

Selection Notes

Select this component when capacitive sensing capabilities are required alongside standard 8-bit MCU functions. Consider the 8 kB Flash limit for firmware size constraints. Evaluate the 1.8 V to 3.6 V operating range against system power requirements. Review the available digital peripherals to ensure sufficient I/O and communication ports for the target application.

Part Context

This part belongs to the C8051F70x/71x family of mixed-signal microcontrollers. These devices combine a high-speed 8051 core with extensive analog and digital peripherals. The family emphasizes integration by including capacitance-to-digital converters and ADCs on a single chip. This approach reduces external component count and simplifies board layout for embedded systems.

Replacement Considerations

Public confirmed substitute part numbers: None identified.