C8051F930-G-GDI

Overview

The C8051F930-G-GDI is a bare die microcontroller from the Silicon Labs C8051F93x family. It features an 8-bit 8051 CISC core with a maximum CPU frequency of 25 MHz. The device integrates 64 KB of Flash program memory and 4.25 KB of RAM. It supports supply voltages between 1.9 V and 2.4 V for automotive applications. The component provides 24 I/Os and includes interfaces such as I2C, SMBus, SPI, and UART. It contains four timers and is compliant with EU hazardous substance restrictions.

Feature Summary

• Automotive-grade qualification for reliable operation in vehicle environments
• Bare die format enabling custom packaging solutions
• Integrated high-speed ADC and mixed-signal peripherals

Applications

• Automotive embedded control systems
• Custom integrated circuit assemblies requiring bare die integration
• Industrial monitoring nodes utilizing automotive-grade components

Procurement Notes

Verify that the procurement channel supplies genuine Silicon Laboratories bare die units. Confirm the specific wafer lot and die marking requirements match your assembly process. Ensure handling procedures account for the unpackage nature of the component to prevent electrostatic discharge damage during placement.

Selection Notes

Select this part when automotive reliability is required alongside custom packaging flexibility. Compare against packaged variants like the C8051F930-G-GMR if standard surface-mount assembly is preferred instead of direct die attachment. Evaluate thermal management capabilities inherent to the bare die form factor for your specific substrate design.

Part Context

This component belongs to the C8051F93x series, which are low-power mixed-signal microcontrollers based on the 8051 architecture. The GDI suffix indicates a bare die configuration intended for flip-chip or wire-bond integration into larger packages or system-in-package designs by the end manufacturer.

Replacement Considerations

The C8051F930-G-GMR is a packaged equivalent within the same family. Verify pinout compatibility and electrical specifications before substituting a packaged version for a bare die requirement.