C8051F930-GDI

Overview

The C8051F930-G-GDI is a bare die variant of the Silicon Labs C8051F93x microcontroller family. It features an 8-bit 8051-compatible CPU with up to 25 MIPS throughput at a 25 MHz clock frequency. The device integrates 64 kB of in-system programmable Flash memory and 4352 bytes of internal data RAM. Key analog peripherals include a 10-bit SAR ADC with up to 23 external inputs, two comparators, and a temperature sensor. Digital interfaces consist of hardware SMBus, dual SPI ports, and UART. The unit supports operation from 0.9 V to 3.6 V via built-in DC-DC converter or LDO regulator.

Feature Summary

• Integrates a high-speed single-cycle 8051 compatible CPU with pipelined architecture for efficient instruction execution.
• Includes a 10-bit SAR ADC with autonomous low power burst mode and 16-bit auto-averaging accumulator for enhanced resolution.
• Features flexible I/O configuration through a priority crossbar decoder allowing dynamic pin assignment.
• Supports ultra-low power consumption with multiple sleep modes and fast wake-up capabilities.

Applications

• Battery-powered home automation systems
• Remote control and garage door openers
• Smart metering and building HVAC control
• Fire and security monitoring devices

Procurement Notes

Verify that the specific ordering suffix GDI corresponds to the bare die package format required for your substrate design. Confirm that the manufacturing site and assembly details align with your supply chain requirements. Ensure compatibility with your chosen packaging technology as this component is not supplied in standard leaded or surface mount packages.

Selection Notes

Select this part when a system requires the specific performance and peripheral set of the C8051F930 but necessitates direct die attachment rather than packaged ICs. Evaluate the thermal management strategy for the bare die implementation. Ensure the PCB layout accommodates the necessary bump or wire bond connections for the 39-pin die wafer configuration.

Part Context

This component belongs to the C8051F9xx series of ultra-low power mixed-signal microcontrollers. It shares the core architecture and peripheral sets with packaged variants such as the C8051F930-G-GMR. The primary distinction lies in the physical form factor, offering a bare die solution for custom packaging applications within the same functional family.

Replacement Considerations

Direct functional equivalents are available in packaged formats, specifically the C8051F930-G-GMR (32-QFN) and C8051F930-G-GQR. These packaged versions contain identical silicon but require different board space and assembly processes compared to the bare die option.