CA28B0805

Overview

The CA28B0805 is a hinged ferrite core manufactured by Leader Tech Inc., designed for cable noise suppression. It features a round shape with an internal diameter of 8.80 mm and an impedance of 73 Ohms at the specified test frequency. The component is packaged in bulk quantities, facilitating integration into wiring harnesses where rapid installation and removal are required without disassembling the entire cable assembly.

Feature Summary

• Hinged design allows for easy installation onto existing cables without disconnecting connectors
• Round geometry provides uniform magnetic coverage around the conductor
• Solid construction ensures consistent electromagnetic interference attenuation

Applications

• Suppression of common-mode noise on single cables
• EMI mitigation in electronic equipment wiring
• Signal integrity enhancement in data transmission lines

Procurement Notes

Verify the specific impedance value and internal diameter against your cable assembly requirements before ordering. Confirm that the hinged mechanism meets the mechanical retention needs of your application. Ensure compliance with relevant environmental regulations such as RoHS if applicable to your region. Check for any specific handling instructions regarding the hinge integrity during shipping and storage.

Selection Notes

Select this model when a non-invasive solution for adding ferrite suppression to existing cables is necessary. The 8.80 mm inner diameter dictates the maximum cable size it can accommodate. Consider the 73 Ohm impedance characteristic for compatibility with the noise frequencies present in your system. Evaluate whether a hinged or split-core design is preferred over solid toroids for maintenance accessibility.

Part Context

This component belongs to the ferrite core category from Leader Tech Inc., specifically engineered for cable-mounted noise suppression. It serves as a passive component to attenuate high-frequency electromagnetic interference. The product line includes various shapes and materials to address different EMI/EMC challenges in electronic systems.