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CBR1F-100 is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is BRIDGE RECT 1P 1KV 1.5A A CASE. Review the specifications below when checking this part for your BOM.
The CBR1F-100 is a single-phase bridge rectifier manufactured by Central Semiconductor Corp. It features a maximum average forward rectified current of 1.0 A and a peak repetitive reverse voltage rating of 1000 V. The device utilizes a standard silicon construction and is housed in an SMA (DO-214AC) surface-mount package. Key electrical characteristics include a maximum non-repetitive peak forward surge current capability, a specified maximum forward voltage drop at rated current, and a low maximum reverse leakage current at the rated blocking voltage. The component is designed for operation within a junction temperature range extending from -65°C to +150°C.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm lead-free status and packaging configuration. Ensure that the selected variant matches the required RoHS compliance standards for your manufacturing process. Cross-reference the part number with authorized distributors to confirm current availability and authenticity before procurement.
Select this component when a 1 A current rating and 1000 V reverse voltage are required in a compact surface-mount form factor. Evaluate the forward voltage drop and reverse leakage specifications against your circuit's efficiency and thermal management requirements. Confirm that the SMA package dimensions fit your PCB layout constraints.
This component belongs to Central Semiconductor's family of surface-mount bridge rectifiers. It shares the same functional category as other models in the series but differs in its specific voltage and current ratings. The SMA package allows for space-efficient designs compared to through-hole alternatives.
Potential substitutes must match the 1 A current rating, 1000 V reverse voltage, and SMA package footprint. Verify pinout compatibility and ensure that the alternative device meets or exceeds the original's thermal and electrical specifications.
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