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CBRDFSH1-100 TR13 PBFREE is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is 1A 100V SMD RECTIFIER-BRIDGE SCH. Review the specifications below when checking this part for your BOM.
The CBRDFSH1-100 TR13 PBFREE is a single-phase bridge rectifier manufactured by Central Semiconductor Corp. It features a peak repetitive reverse voltage of 100V and an average forward current rating of 1.0A. The device exhibits a maximum non-repetitive surge current capacity of 30A and a typical junction capacitance of 250pF. Designed for surface mount applications, it utilizes the HDDIP-4 package configuration with solder pad termination. The component operates within a temperature range from -65°C to +150°C junction temperature.
Verify the specific ordering suffix against manufacturer documentation to ensure correct packaging configuration. Confirm RoHS compliance status through official datasheets prior to integration. Cross-reference the part number with authorized distributor catalogs to validate authenticity and traceability. Ensure storage conditions align with moisture sensitivity level requirements specified in the technical data.
Select this component when a low-voltage, high-current surface mount bridge rectifier is required. Evaluate the 100V reverse voltage rating against peak circuit line voltages. Consider the 30A surge rating for inrush current protection during startup phases. Compare physical dimensions of the HDDIP-4 package against available PCB real estate constraints.
This part belongs to the CBRDFSH series of surface mount bridge rectifiers from Central Semiconductor. The series provides various voltage ratings for different power application needs. The TR13 designation indicates tape and reel packaging suitable for automated assembly processes. This specific model targets applications requiring robust performance in compact form factors.
Consult official substitution lists for direct equivalents. Verify pinout compatibility and thermal characteristics before replacing. Check if alternative packages require layout modifications.
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