CC1110F32RSP

RF Transceiver ICS Overview

The CC1110F32RSP is a Sub-1 GHz wireless MCU featuring an 8051 core and RF transceiver. It operates at 315 MHz, 433 MHz, 868 MHz, and 915 MHz with a maximum data rate of 500 kbps. The device provides 10 dBm output power and -112 dBm sensitivity. It includes 32 kB program memory and 4 kB RAM. Supply voltage ranges from 2 V to 3.6 V. Receive current is 16.2 mA and transmit current is 15.2 mA. Operating temperature spans -40°C to +85°C. It uses a QFN-36 package.

RF Transceiver ICS Feature Summary

• Integrates an 8051 microcontroller with a Sub-1 GHz ISM band transceiver on a single chip
• Includes hardware security coprocessor supporting 128-bit AES encryption
• Features multiple communication interfaces including USART, SPI, I2C, and USB

RF Transceiver ICS Applications

• Wireless sensor networks
• Remote control systems
• Telemetry applications

RF Transceiver ICS Procurement Notes

Verify the specific suffix RSP indicates the QFN-36 package variant distinct from RHHR or RHHT tape-and-reel options. Confirm RoHS compliance status through official documentation. Ensure compatibility with required operating temperature range specifications for the target environment before finalizing procurement.

RF Transceiver ICS Selection Notes

Select this component when a combined MCU and RF solution is required for Sub-1 GHz bands. The 8051 architecture offers established development support. Consider the 32 kB Flash capacity for application code size. Evaluate the QFN-36 package constraints against PCB layout requirements compared to other pinout variants in the series.

RF Transceiver ICS Part Context

This part belongs to the Texas Instruments CC1110x family of wireless MCUs. It shares core functionality with variants like CC1110F32RHHR but differs in packaging. The family targets low-power wireless connectivity needs. It competes in the integrated transceiver-MCU market segment.

RF Transceiver ICS Replacement Considerations

CC1110F32RHHR and CC1110F32RHHT are functionally equivalent within the same package type family but differ in shipping packaging. Cross-reference pinouts carefully as package variations may affect thermal performance and mounting.