CD0.2A30

CD0.2A30

$1.67
  • Description:DIODE SCHOTTKY 30V 200MA DIE
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)

SKU:33f00c23736e Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DIODE SCHOTTKY 30V 200MA DIE
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):30 V
  • Current - Average Rectified (Io):200mA
  • Voltage - Forward (Vf) (Max) @ If:500 mV @ 200 mA
  • Speed:Small Signal =< 200mA (Io), Any Speed
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:5 µA @ 30 V
  • Capacitance @ Vr, F:50pF @ 0V, 1MHz
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Operating Temperature - Junction:-65°C ~ 125°C
  • Grade:-
  • Qualification:-

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CD0.2A30

Overview

The CD0.2A30 is a small-signal Schottky diode manufactured by Microchip Technology, constructed using silicon technology. It features a surface-mount die configuration designed for integration into compact electronic circuits. The component supports an average rectified current of 200mA and operates with a maximum repetitive peak reverse voltage of 30V. Key electrical characteristics include a capacitance of 50pF measured at 0V and 1MHz. This device is categorized under single diodes and is suitable for applications requiring efficient signal rectification or clamping in low-power environments.

Feature Summary

  • Utilizes Schottky barrier technology to achieve fast switching speeds and low forward voltage drop.
  • Designed as a bare die for direct surface-mount attachment to substrates or multi-chip modules.
  • Provides reliable performance in small-signal applications with minimal power loss.

Applications

  • High-frequency signal rectification in communication systems
  • Clamping diodes in protection circuits
  • Power supply input rectification for low-current loads

Procurement Notes

Verify the specific datasheet version and mechanical dimensions directly with Microchip Technology before design finalization. Confirm that the receiving facility has the necessary equipment for handling bare die components, including precise placement and bonding capabilities. Ensure compliance with all relevant environmental regulations and quality standards applicable to your region and industry sector prior to procurement.

Selection Notes

Select this component when a surface-mount Schottky diode with a 30V rating and 200mA current capacity is required in a bare die format. Consider its low capacitance for high-speed signal integrity. Evaluate thermal management requirements for the substrate, as heat dissipation depends on the mounting surface area and material properties rather than a standard package.

Part Context

This part belongs to Microchip Technology's portfolio of discrete semiconductor devices, specifically within the single diodes category. It represents a specialized form factor compared to standard packaged diodes, intended for custom assembly processes. The product line focuses on providing robust silicon-based solutions for various industrial and commercial electronic applications requiring precise voltage regulation and signal control.

Replacement Considerations

Consult official Microchip documentation for verified substitute part numbers. Cross-referencing with other manufacturers requires careful comparison of electrical parameters, physical dimensions, and mounting specifications to ensure functional compatibility without compromising circuit performance or reliability.

FAQ

What is the maximum repetitive peak reverse voltage for the CD0.2A30?

The maximum repetitive peak reverse voltage is 30V.

Is the CD0.2A30 available in a standard package?

No, it is supplied as a surface-mount die for direct attachment.

What is the typical capacitance value at 0V?

The capacitance is 50pF at 0V and 1MHz.

CD0.2A30CD0.2A30
$1.67
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