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Product Detailed Parameters
- Description：DIODE STANDARD 100V 150MA 1206
- Series：-
- Mfr：Bourns Inc.
- Package：Tape & Reel (TR)
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：100 V
- Current - Average Rectified (Io)：150mA
- Voltage - Forward (Vf) (Max) @ If：1 V @ 50 mA
- Speed：Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr)：4 ns
- Current - Reverse Leakage @ Vr：2.5 µA @ 100 V
- Capacitance @ Vr, F：3pF @ 0V, 100MHz
- Mounting Type：Surface Mount
- Package / Case：1206 (3216 Metric)
- Supplier Device Package：1206
- Operating Temperature - Junction：-55°C ~ 125°C
- Grade：-
- Qualification：-
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Overview
The Bourns CD1206-S01575 is a surface-mount switching diode in a 1206 package. It features a single diode configuration with two pins and silicon junction technology. The component has a maximum forward voltage drop of 1V. It operates within a temperature range of -55 °C to +125 °C. Physical dimensions are 3.4mm length, 1.7mm width, and 0.95mm height.
Feature Summary
- Leadless 1206 surface mount package for PCB space savings
- Flat configuration minimizes rollaway during automated assembly
- Compatible with standard pick-and-place equipment
Applications
- Digital signal switching
- Low power signal rectification
- Voltage clamping
Procurement Notes
Verify the specific suffix S01575 against official Bourns documentation to confirm exact electrical tolerances and termination plating specifications. Ensure the selected variant meets RoHS compliance requirements for your manufacturing process. Confirm JEDEC standard adherence for reliability validation.
Selection Notes
Select this component when a compact, leadless silicon switching diode is required for high-density layouts. The 1206 footprint offers a balance between current handling and board real estate. Consider the -55 °C to +125 °C operating range for environmental suitability in consumer or industrial electronics.
Part Context
This part belongs to Bourns' small signal chip diode series designed for miniaturization. The product line addresses the industry trend toward smaller electronic components by providing silicon diodes with minimal packaging overhead. These devices are intended for portable communication, computing, and media applications.
Replacement Considerations
Consult official Bourns cross-reference guides for verified substitutes. Generic equivalents may differ in forward voltage characteristics or thermal performance. Verify pinout compatibility and package dimensions before substitution.
