CD1408-R1600

Overview

The Bourns CD1408-R1600 is a leadless chip diode designed for surface-mount applications. It features a compact 1408 package size, allowing for significant PCB real estate savings compared to traditional packages. The component utilizes copper/nickel/gold plated terminations and is compatible with standard pick-and-place equipment. Its flat configuration minimizes rollaway during manufacturing.

Feature Summary

• Leadless design for space-constrained layouts
• Flat configuration prevents component rolling
• Compatible with standard SMD assembly processes

Applications

• Mobile communication devices
• Audiovisual equipment
• Miniaturized electronic systems

Procurement Notes

Verify the specific datasheet revision and RoHS compliance status before integration. Confirm that the leadless termination style matches your assembly capabilities. Ensure the JEDEC conformity meets your quality standards. Check for any conflict mineral reporting requirements relevant to your supply chain regulations.

Selection Notes

Select this component when board space is limited and high-volume automated placement is required. The leadless construction offers advantages over pin-based alternatives in dense designs. Consider the thermal and electrical characteristics relative to other small-signal diodes in the same package family.

Part Context

This part belongs to Bourns' Chip Diode series, which addresses the industry demand for smaller semiconductor components. The series includes various package sizes like 0603, 1005, and 1206. These diodes are engineered to provide silicon functionality with minimal packaging overhead.

Replacement Considerations

Consult official Bourns documentation for confirmed substitute part numbers. Do not assume cross-compatibility with generic equivalents without verifying electrical parameters and physical dimensions.